Apparatus for material spray deposition of high solid percentage slurries for battery active material manufacture applications
US-2015372286-A1 · Dec 24, 2015 · US
Film coating apparatus
US9724710B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9724710-B2 |
| Application number | US-201514638426-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 4, 2015 |
| Priority date | Mar 31, 2014 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
In general, according to one embodiment, a film coating apparatus includes a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential adjusting module configured to make a potential of the mask equal to a potential of the film formation object.
First claim
Opening claim text (preview).
What is claimed is: 1. A film coating apparatus comprising: a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential adjusting module configured to make a potential of the mask equal to a potential of the film formation object, wherein the potential adjusting module includes a film formation object grounding module configured to ground the film formation object, and a mask grounding module configured to ground the mask, the mask includes a metal portion and a resin portion provided on the metal portion, the metal portion is grounded, and the resin portion includes a cover portion configured to cover an edge of the metal portion on the non-coating portion side, and the metal portion is not in contact with the film formation object, and a spacing is provided between the metal portion and the non-coating portion. 2. A film coating apparatus comprising: a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential increase prevention module configured to prevent an increase in potential of the mask, wherein the potential increase prevention module is a mask grounding module configured to ground the mask, the mask includes a metal portion and a resin portion provided on the metal portion, the metal portion is grounded, and the resin portion includes a cover portion configured to cover an edge of the metal portion on the non-coating portion side, and the metal portion is not in contact with the film formation object, and a spacing is provided between the metal portion and the non-coating portion.
Assignees
Inventors
Classifications
- B05B5/0255Primary
spraying and depositing by electrostatic forces only · CPC title
Operations & Transport · mapped topic
- B05B13/0221Primary
characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts (B05B13/0207 takes precedence; conveyors in general B65G) · CPC title
the liquid or other fluent material being electrically conductive · CPC title
Masking elements, i.e. elements defining uncoated areas on an object to be coated · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9724710B2 cover?
- In general, according to one embodiment, a film coating apparatus includes a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a posit…
- Who is the assignee on this patent?
- Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification B05B5/0255. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).