OLED panel, method for fabricating the same, screen printing plate, display device

Patent metadata

Field	Value
Publication number	US-9722214-B2
Application number	US-201514784640-A
Country	US
Kind code	B2
Filing date	Oct 15, 2015
Priority date	Nov 10, 2014
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

The present invention provides an OLED panel and a method for fabricating the same, a screen printing plate, and a display device. The method comprises: forming an OLED mother board, wherein supporting adhesive is formed between an upper base plate and a lower base plate of the OLED mother board, and said supporting adhesive is located below a cutting line; and cutting said OLED mother board along said cutting line to obtain OLED panels. In the fabricating method of the present invention, when the OLED mother board is cut by a cutter wheel, the upper and lower base plate of the OLED mother board is subject to small deformation due to support of the supporting adhesive. As a result, travelling accuracy of the cutter wheel is improved, the distance between the cutting line and packaging adhesive is greatly reduced, and the frame width of the fabricated OLED panel is far less than that of an OLED panel fabricated by a conventional method.

First claim

The invention claimed is:

1. A method for fabricating an OLED panel, comprising the steps of:
forming an OLED mother board, wherein a packaging adhesive and a supporting adhesive are formed between an upper base plate and a lower base plate of the OLED mother board, said packaging adhesive is arranged around a display area for sealing the upper base plate and the lower base plate, said supporting adhesive is located below a cutting line, and said packaging adhesive and said supporting adhesive are formed in a same process by printing; and
cutting said OLED mother board along said cutting line to obtain OLED panels.

2. The method of claim 1 , wherein a gap with a preset distance lies between said packaging adhesive and said supporting adhesive.

3. The method of claim 1 , wherein said supporting adhesive is made from glass frit.

4. The method of claim 1 , wherein said packaging adhesive and said supporting adhesive are connected with each other.

5. A screen printing plate comprising:
a first pattern region which is adapted to print a packaging adhesive onto a marginal region of each OLED panel on an OLED mother board; and
a second pattern region which is adapted to print a supporting adhesive below a cutting line,
wherein a gap with a preset distance lies between said first pattern region and said second pattern region;
wherein a region in said first pattern region which corresponds to an edge of said packaging adhesive has an aperture ratio larger than that of other regions in said first pattern region.

6. The screen printing plate of claim 5 , wherein said first pattern region and said second pattern region are connected with each other.

7. A screen printing plate comprising:
a first pattern region which is adapted to print a packaging adhesive onto a marginal region of each OLED panel on an OLED mother board; and
a second pattern region which is adapted to print a supporting adhesive below a cutting line,
wherein a gap with a preset distance lies between said first pattern region and said second pattern region;
wherein a region in said second pattern region which corresponds to an edge of said supporting adhesive has an aperture ratio larger than that of other regions in said second pattern region.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Sun Liang

Classifications

• B41F15/36 Primary

  flat · CPC title

• B41F15/02

  Manually-operable devices · CPC title

• H01L51/56 Primary

  Electricity · mapped topic

• H01L51/524

  Electricity · mapped topic

• H10K59/871

  Self-supporting sealing arrangements · CPC title