Optoelectronic component with a pre-oriented molecule configuration and method for producing an optoelectronic component with a pre-oriented molecule configuration

Patent metadata

Field	Value
Publication number	US-9722159-B2
Application number	US-201314430735-A
Country	US
Kind code	B2
Filing date	Sep 6, 2013
Priority date	Sep 24, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

An optoelectronic component includes a substrate, a connecting element applied on the substrate and a layer sequence that emits electromagnetic radiation. The layer sequence is applied on the connecting element. The connecting element includes at least one connecting material that has an oriented molecular configuration. The connecting element has at least one parameter that is anisotropic.

First claim

The invention claimed is:

1. An optoelectronic component comprising:
a substrate;
a connecting element disposed on the substrate; and
a layer sequence disposed on the connecting element, the layer sequence configured to emit electromagnetic radiation,
wherein the connecting element comprises a connecting material,
wherein the connecting material has an pre-oriented molecule configuration,
wherein the connecting element has at least one parameter which is anisotropic,
wherein the connecting element connects the substrate to the layer sequence,
wherein the connecting material comprises a material selected from the group consisting of polymers, block copolymers, graft polymers, dendrimers and combinations thereof,
wherein more than 80% of molecule longitudinal axes of individual molecules of the connecting material have a predominantly perpendicular orientation to a surface of the substrate,
wherein the connecting material has properties so that it is pre-oriented before application and requires no additional treatment for orientation after application,
wherein the connecting element is an adhesive film or adhesive foil, and
wherein, in the pre-oriented molecule configuration, the connecting element has an anisotropic thermal conductivity in a direction perpendicular to the surface of the substrate.

2. The optoelectronic component according to claim 1 , wherein the connecting element is transparent.

3. The optoelectronic component according to claim 1 , wherein the connecting material comprises a combination of graphene with polymers, block copolymers, graft polymers or dendrimers.

4. The optoelectronic component according to claim 1 , wherein the connecting material is formed as particles and is embedded in a matrix material.

5. The optoelectronic component according to claim 1 , wherein the connecting element is formed as a layer.

6. The optoelectronic component according to claim 1 , wherein individual molecules of the connecting material are arranged predominantly parallel to one another among one another.

7. The optoelectronic component according to claim 1 , wherein individual molecules of the connecting material are arranged predominantly parallel and/or perpendicular to the surface of the substrate which faces toward the connecting element.

8. The optoelectronic component according to claim 1 , wherein the connecting element is formed as a film.

9. The optoelectronic component according to claim 1 , wherein the connecting material is crystalline.

10. The optoelectronic component according to claim 1 , wherein the connecting material is amorphous.

11. The optoelectronic component according to claim 1 , wherein the connecting element comprises a crystalline connecting material, and wherein the connecting element has a thermal conductivity of greater than or equal to 37 W/mk.

12. A method for producing an optoelectronic component, the method comprising:
providing a substrate;
forming a connecting element on the substrate; and
applying a layer sequence on the connecting element, the layer sequence configured to emit electromagnetic radiation,
wherein the connecting element comprises at least one connecting material,
wherein the connecting material has a permanent pre-oriented molecule configuration,
wherein the connecting element has at least one parameter which is anisotropic,
wherein the connecting element connect connects the substrate to the layer sequence,
wherein the connecting material comprises a material selected from the group consisting of polymers, block copolymers, graft polymers, dendrimers and combinations thereof,
wherein more than 80% of molecule longitudinal axes of individual molecules of the connecting material have a predominantly perpendicular orientation to a surface of the substrate,
wherein the connecting element is an adhesive film or adhesive foil, the connecting material having the permanent pre-oriented molecule configuration so that the connecting element is pre-oriented before forming the connecting element and no additional treatment for orientation is performed after forming the connecting element, and
wherein, in the permanent pre-oriented molecule configuration, the connecting element has an anisotropic thermal conductivity in a direction perpendicular to the surface of the substrate.

13. The method according to claim 12 , wherein the oriented molecule configuration of the connecting material is produced by thermal treatment, application of an electric field, treatment with pressure or an action of a force.

14. The method according to claim 12 , further comprising, heating the substrate, such that an oriented molecule configuration of the connecting material is produced during the forming of the connecting element to the substrate.

15. A method for producing an optoelectronic component, the method comprising:
providing a substrate;
applying an adhesive film or adhesive foil connecting element to the substrate, the connecting element comprising a connecting material selected from the group consisting of polymers, block copolymers, graft polymers, dendrimers and combinations thereof, the connecting material having a permanent pre-oriented molecule configuration so that the connecting element is pre-oriented before applying the connecting element and no additional treatment for orientation is performed after applying the connecting element, wherein more than 80% of molecule longitudinal axes of individual molecules of the connecting material have a predominantly perpendicular orientation to a surface of the substrate, and wherein, in the permanent pre-oriented molecule configuration, the connecting element has an anisotropic thermal conductivity in a direction perpendicular to the surface of the substrate; and
forming a layer sequence on the connecting element, the layer sequence configured to emit electromagnetic radiation,
wherein the connecting element is transparent and comprises the connecting material embedded in a matrix material, wherein the matrix material is isotropic, wherein the connecting material comprises particles that have the anisotropic thermal conductivity such that the connecting element is a partially oriented film or foil, and wherein a diameter of the particles of the connecting material is greater than a thickness of the film or foil.

16. The method according to claim 15 , wherein the pre-oriented molecule configuration of the connecting material is produced by thermal treatment, application of an electric field, treatment with pressure or an action of a force.

17. The method according to claim 15 , further comprising heating the substrate, such that the pre-oriented molecule configuration of the connecting material is produced while applying the connecting element to the substrate.

18. The method according to claim 15 , wherein the connecting comprises a combination of graphene with polymers, block copolymers, graft polymers or dendrimers.

19. The method according to claim 15 , wherein the connecting element has a thermal conductivity of greater than or equal to 37 W/mk.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Streitel Reinhard
• Schmidtke Kathy

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title