ABSORBENT Cu2ZnSn(S,Se)4-BASED MATERIAL HAVING A BAND-SEPARATION GRADIENT FOR THIN-FILM PHOTOVOLTAIC APPLICATIONS
US-2015214401-A1 · Jul 30, 2015 · US
US9722120B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9722120-B2 |
| Application number | US-201514853463-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2015 |
| Priority date | Sep 14, 2015 |
| Publication date | Aug 1, 2017 |
| Grant date | Aug 1, 2017 |
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A method for fabricating a photovoltaic device includes forming a polycrystalline absorber layer including Cu—Zn—Sn—S(Se) (CZTSSe) over a substrate. The absorber layer is rapid thermal annealed in a sealed chamber having elemental sulfur within the chamber. A sulfur content profile is graded in the absorber layer in accordance with a size of the elemental sulfur and an anneal temperature to provide a graduated bandgap profile for the absorber layer. Additional layers are formed on the absorber layer to complete the photovoltaic device.
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The invention claimed is: 1. A method for fabricating a photovoltaic device, comprising: forming a polycrystalline absorber layer including Cu—Zn—Sn—S(Se) (CZTSSe) over a substrate, wherein the absorber layer has a front surface; rapid thermal annealing the absorber layer in a sealed chamber having a piece of elemental sulfur within the chamber, wherein the elemental sulfur is located other than on the front surface of the absorber layer; grading a sulfur content profile in the absorber layer in accordance with a shape and dimensions of the piece of elemental sulfur and an anneal temperature to provide a graduated bandgap profile for the absorber layer; and forming additional layers on the absorber layer to complete the photovoltaic device. 2. The method as recited in claim 1 , wherein rapid thermal annealing includes applying a temperature of about 590 degrees C. for about 120 seconds to concurrently increase grain size of grains in the absorber layer. 3. The method as recited in claim 1 , wherein rapid thermal annealing includes applying a temperature of between about 290 degrees C. and about 490 degrees C. for about 120 seconds. 4. The method as recited in claim 1 , wherein rapid thermal annealing includes increasing grain size for the CZTSSe in the absorber layer. 5. The method as recited in claim 1 , wherein grading the sulfur content profile includes higher sulfur content at a junction with the additional layers. 6. The method as recited in claim 1 , wherein grading the sulfur content profile includes higher sulfur content at the front surface and a back surface of the absorber layer. 7. The method as recited in claim 1 , further comprising controlling secondary phase formation of sulfur compounds in the chamber. 8. The method as recited in claim 7 , wherein controlling secondary phase formation of sulfur compounds in the chamber includes placing a piece of SnS in the chamber. 9. The method as recited in claim 1 , wherein forming additional layers on the absorber layer includes: forming a semiconductor layer on the absorber layer; and forming a transparent conductor over the semiconductor layer. 10. A method for fabricating a photovoltaic device, comprising: forming a polycrystalline absorber layer including Cu—Zn—Sn—S(Se) (CZTSSe) over a substrate, wherein the absorber layer has a front surface; placing a piece of elemental sulfur in a chamber, wherein the elemental sulfur is located other than on the front surface of the absorber layer; placing a secondary phase blocker in the chamber; rapid thermal annealing the absorber layer with the elemental sulfur and the secondary phase blocker in the chamber after being sealed by applying a temperature of between about 290 degrees C. and about 490 degrees C. for about 120 seconds; grading a sulfur content profile in the absorber layer in accordance with a shape and dimensions of the piece of elemental sulfur and an anneal temperature to provide a graduated bandgap profile for the absorber layer; and forming additional layers on the absorber layer to complete the photovoltaic device. 11. The method as recited in claim 10 , wherein grading the sulfur content profile includes higher sulfur content at a junction with the additional layers. 12. The method as recited in claim 10 , wherein grading the sulfur content profile includes higher sulfur content at the front surface and a back surface of the absorber layer. 13. The method as recited in claim 10 , wherein placing the secondary phase blocker includes placing a piece of SnS in the chamber. 14. The method as recited in claim 10 , wherein forming additional layers on the absorber layer includes: forming a semiconductor layer on the absorber layer; and forming a transparent conductor over the semiconductor layer.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers · CPC title
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