Thermal flow meter

Patent metadata

Field	Value
Publication number	US-9721908-B2
Application number	US-201314407123-A
Country	US
Kind code	B2
Filing date	May 31, 2013
Priority date	Jun 15, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512 , sealing with a mold resin, and cutting off the support frame 512 , wherein cut end portions 544 a and 545 a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.

First claim

The invention claimed is:

1. A thermal flow meter comprising:
a circuit package formed by mounting a detection element on a lead supported by a support frame, sealing with a mold resin, and cutting off the support frame; and
a housing to which the circuit package is fixed, wherein
the circuit package is sealed with a first mold resin through a first resin molding process, the housing is formed of a second mold resin through a second resin molding process,
a cut end portion of the lead exposed from the mold resin of the circuit package by cutting the support frame is covered by a covering portion, and
the covering potion is formed of the second mold resin in the second resin molding process.

2. The thermal flow meter according to claim 1 , wherein the covering portion is formed to cover between the cut end portions of at least a pair of the leads having a potential difference.

3. The thermal flow meter according to claim 1 , wherein the circuit package has a package body which is fixed to the housing and a protrusion which protrudes from the package body and is exposed from the housing and in which the detection element is disposed,
a cut end portion of the lead has a first cut end portion disposed to be exposed on a side surface on one side in a width direction perpendicular to a protruding direction of the protrusion and a second cut end portion facing the first cut end portion and disposed to be exposed on a side surface on the other side in the width direction, and
the covering portion has a ring shape or a C shape fitted to the outside of the protrusion at a position where the covering portion faces the first cut end portion and the second cut end portion and adhered to the protrusion.

4. The thermal flow meter according to claim 3 , wherein the first cut end portion and the second cut end portion are arranged to be exposed on the base end side of the protrusion relative to the detection element.

5. The thermal flow meter according to claim 3 , further comprising fixing means fixing the covering portion to the protrusion.

6. The thermal flow meter according to claim 5 , wherein the fixing means has a concave portion included in any one of the protrusion and the covering portion and a convex portion included in the other and fitted into the concave portion.

7. The thermal flow meter according to claim 5 , wherein the fixing means has a coupling portion whose one end is fixed to the housing and the other end is fixed to the covering portion.

8. The thermal flow meter according to claim 7 , wherein the coupling portion is formed of the second mold resin in the second resin molding process.

9. The thermal flow meter according to claim 3 , wherein in the protrusion, a resin thickness of the mold resin on the tip end side is smaller than that on the base end side.

10. The thermal flow meter according to claim 1 , wherein the covering portion is formed by coating an adhesive to the cut end portion of the lead.

11. A thermal flow meter comprising:
a circuit package formed by mounting a detection element on a lead supported by a support frame, sealing with a mold resin, and cutting off the support frame, wherein
a cut end portion of the lead exposed from the mold resin of the circuit package by cutting the support frame is covered by a covering portion,
the circuit package has a package body which is fixed to the housing and a protrusion which protrudes from the package body and is exposed from the housing and in which the detection element is disposed,
a cut end portion of the lead has a first cut end portion disposed to be exposed on a side surface on one side in a width direction perpendicular to a protruding direction of the protrusion and a second cut end portion facing the first cut end portion and disposed to be exposed on a side surface on the other side in the width direction, and
the covering portion has a ring shape or a C shape fitted to the outside of the protrusion at a position where the covering portion faces the first cut end portion and the second cut end portion and adhered to the protrusion.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tashiro Shinobu
• Hanzawa Keiji
• Tokuyasu Noboru
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W76/60

  Seals · CPC title

• H10W42/00 Primary

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title