Optical waveguide, optical interconnection component, optical module, opto-electric hybrid board, and electronic device

Patent metadata

Field	Value
Publication number	US-9720171-B2
Application number	US-201314408448-A
Country	US
Kind code	B2
Filing date	Jun 18, 2013
Priority date	Jun 19, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

In accordance with the present invention, an opto-electric hybrid board in which optical wiring is freely disposed without restriction by the arrangement of electrical elements and the like, and in which high-density mounting of electrical wiring and optical wiring is possible, and an electric device including this opto-electric hybrid board are provided. An opto-electrical hybrid board ( 1000 ) of the present invention has an optical waveguide ( 1 ), an optical connector disposed at an end section of the optical waveguide ( 1 ), and an opto-electric conversion section ( 4 ) disposed below the optical waveguide ( 1 ), and a motherboard (electrical wiring board) ( 5 ) disposed below the opto-electric conversion portion ( 4 ). Of these, the optical waveguide ( 1 ) includes a core layer ( 13 ) including a plurality of core sections ( 14 ) being configured to intersect with each other at one plane and side surface cladding sections, and a mirror (optical path conversion section) 17 converting the optical path of the core sections ( 14 ). Also, between the optical waveguide ( 1 ) and the motherboard ( 5 ) is connected via an electrical connector and preferably both the optical waveguide ( 1 ) and the motherboard ( 5 ) are detachable.

First claim

The invention claimed is:

1. An opto-electric hybrid board, comprising:
an electrical wiring board including a first substrate, an electrical wiring disposed on an inside of the first substrate or on a surface of the first substrate, and an electrical element mounted on the first substrate; and
an optical waveguide film configured such that a signal associated with opto-electric conversion is transmitted between the optical waveguide film and the electrical wiring board and positioned on the electrical wiring board such that the electrical element is positioned between the optical waveguide film and the first substrate,
wherein the optical waveguide film includes a core layer including a plurality of core sections and a side surface cladding section formed adjacent to a side surface of each of the core sections and an optical path conversion element configured to convert an optical path of the core sections, the core sections intersect each other on one plane, the core layer has a refractive index distribution in a width direction of the core layer such that the refractive index distribution has a maximum value, a first and second secondary maximum values smaller than the maximum value and a first and second minimum values in an order of the first secondary maximum value, the first minimum value, the maximum value, the second minimum value and the second secondary maximum value, a section between the first and second minimum values including the maximum value corresponds to the core section, and a section including the first or second secondary maximum value corresponds to the side surface cladding section.

2. The opto-electric hybrid board according to claim 1 , wherein the optical waveguide film is detachable from the electrical wiring board.

3. The opto-electric hybrid board according to claim 1 , wherein the optical waveguide film further includes an opto-electric conversion element including a second substrate, an electrical wiring disposed on an inside of the second substrate or on a surface of the second substrate, and an optical element mounted on the second substrate, the optical path conversion element of the optical waveguide is film optically connected to the optical element of the opto-electric conversion element, and the electrical wiring of the opto-electric conversion element is configured to be electrically connected to the electrical wiring of the electrical wiring board.

4. The opto-electric hybrid board according to claim 3 , wherein the electrical wiring board further comprises an electrical connector configured to be electrically connected to the electrical wiring of the opto-electric conversion element and connected to the electrical wiring of the electrical wiring board.

5. The opto-electric hybrid board according to claim 3 , wherein the opto-electric conversion element further includes a radiator covering the optical element.

6. The opto-electric hybrid board according to claim 1 , wherein the optical waveguide film further includes a metal layer positioned on at least one surface of the core layer.

7. The opto-electric hybrid board according to claim 6 , wherein the metal layer includes as a main component aluminum, iron, copper, or an alloy of aluminum, iron or copper.

8. The opto-electric hybrid board according to claim 6 , wherein the metal layer is in direct contact with the electrical element or in indirect contact with the electrical element via a heat conduction section.

9. The opto-electric hybrid board according to claim 1 , wherein the optical waveguide film is positioned such that a space is formed between the first substrate of the electrical wiring board and the optical waveguide film.

10. The opto-electric hybrid board according to claim 1 , further comprising:
a motherboard,
wherein the electrical wiring board is forming an electrical interposer and mounted on the motherboard, and the optical waveguide film is configured such that the optical waveguide film covers the electrical element of the electrical interposer and that the electrical element is positioned between the optical waveguide film and the first substrate.

11. The opto-electric hybrid board according to claim 10 , wherein the electrical wiring board further includes a metal layer positioned on each side of the first substrate, and a via post connecting the metal layers by penetrating the first substrate.

12. The opto-electric hybrid board according to claim 1 , wherein the electrical wiring board further includes a metal layer positioned on at least one side of the first substrate.

13. The opto-electric hybrid board according to claim 1 , further comprising:
an optical connector attached to an end section of the core sections.

14. An electronic device, comprising:
the opto-electric hybrid board according to claim 1 .

15. An optical waveguide, comprising:
a core layer including a through-hole configured to insert an electrical element therein when the optical waveguide is superimposed on an electrical wiring board having the electrical element, the core layer including a core section and a side surface cladding section formed adjacent to each side surface of the core section; and
an optical path conversion element configured to convert an optical path of the core section,
wherein the core layer has a refractive index distribution in a width direction of the core layer such that the refractive index distribution has a maximum value, a first and second secondary maximum values smaller than the maximum value and a first and second minimum values in an order of the first secondary maximum value, the first minimum value, the maximum value, the second minimum value and the second secondary maximum value, a section between the first and second minimum values including the maximum value corresponds to the core section, and a section including the first or second secondary maximum value corresponds to the side surface cladding section.

16. The optical waveguide according to claim 15 , further comprising:
a metal layer positioned on one side of the core layer such that the metal layer blocks at least a part of the through-hole.

17. The optical waveguide according to claim 16 , wherein the metal layer includes as a main component one of copper, a copper alloy, aluminum, and an aluminum alloy.

18. The optical waveguide according to claim 15 , wherein the core layer includes a plurality of core sections such that the plurality of core sections intersect with each other on one plane.

19. The optical waveguide according to claim 18 , wherein each of the core sections has the refractive index distribution continuously decreasing from the maximum value toward each of the first and second minimum values.

20. The optical waveguide according to claim 16 , further comprising:
a lens positioned on a side of the core layer other than the side on which the metal layer is positioned.

21. An optical interconnection component, comprising:
an optical waveguide according to claim 15 ; and
an optical connector attached to an end section of the core section.

22. An optical module, comprising:
an optical waveguide according to claim 15 ; and
an optical element positioned on one side of the core layer and optically connected to the optical path conversion element.

23. The optical module according to claim 22 , further comprising:
a radiator covering the optical element.

24. The optical module according to claim 22 , further comprising:
a substrate

Assignees

• Sumitomo Bakelite Co

Inventors

• Arai Shinya

Classifications

• G02B6/122 Primary

  Basic optical elements, e.g. light-guiding paths · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/43

  Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

• G02B6/125

  Bends, branchings or intersections · CPC title