Wafer edge inspection with trajectory following edge profile

Patent metadata

Field	Value
Publication number	US-9719943-B2
Application number	US-201514865457-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Sep 30, 2014
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

This inspection system has an optical head, a support system, and a controller in electrical communication with the support system. The support system is configured to provide movement to the optical head with three degrees of freedom. The controller is programmed to control movement of the optical head using the support system such that the optical head maintains a constant angle of incidence relative to a wafer surface while imaging a circumferential edge of the wafer. An edge profiler may be scanned across the wafer to determine an edge profile. A trajectory of the optical head can be determined using the edge profile.

First claim

What is claimed is:

1. An inspection system comprising:
an optical head;
a support system configured to provide movement to the optical head with three degrees of freedom around a circumferential edge of the wafer;
a controller in electrical communication with the support system, the controller being programmed to control movement of the optical head using the support system such that the optical head maintains a constant angle of incidence relative to a wafer surface while imaging the circumferential edge of the wafer; and
an edge profiler operatively connected to the controller, wherein the edge profiler is a shadowgram imaging system that includes a collimated light source and a camera, wherein the camera is configured to receive collimated light from the collimated light source and image a shadow of the circumferential edge of the wafer.

2. The inspection system of claim 1 , wherein the optical head comprises an imaging system.

3. The inspection system of claim 2 , wherein the optical head further comprises the edge profiler.

4. The inspection system of claim 1 , wherein the controller is configured to move the optical head from a first surface of the wafer to a second surface of a wafer.

5. The inspection system of claim 1 , wherein the support system is configured to move the optical head in a direction perpendicular to the wafer surface.

6. The inspection system of claim 1 , wherein the support system is configured to move the optical head in a direction radially with respect to the wafer.

7. The inspection system of claim 1 , wherein the support system is configured to rotate the optical head about an axis which is tangential with respect to the circumferential edge.

8. The inspection system of claim 1 , further comprising a platen configured to support the wafer.

9. The inspection system of claim 8 , wherein the platen is configured to rotate the wafer about a central axis of the wafer.

10. A method comprising:
collecting and analyzing a shadowgram edge profile image of a wafer to determine an edge profile, wherein the shadowgram edge profile image is a shadow of a circumferential edge of the wafer generated using collimated light;
determining a trajectory of an optical head using the shadowgram edge profile, wherein a constant angle of incidence is maintained relative to a wafer surface while imaging a circumferential edge of the wafer using the trajectory;
moving the optical head along the trajectory; and
generating an image of the circumferential edge of the wafer.

11. The method of claim 10 , wherein images are generated as a sum and difference of two individually orthogonally-polarized reflected incident beams.

12. The method of claim 10 , wherein the imaging is between a first surface of the wafer to an opposite second surface of the wafer.

13. A system comprising:
a processor;
a storage device in electronic communication with the processor; and
a communication port in electronic communication with the processor;
wherein the processor is programmed to:
receive a shadowgram edge profile of a wafer, wherein the shadowgram edge profile image is a shadow of a circumferential edge of the wafer generated using collimated light;
determine a trajectory of an optical head using the shadowgram edge profile, wherein a constant angle of incidence is maintained relative to a wafer surface while imaging a circumferential edge of the wafer using the trajectory; and
send instructions to move the optical head along the trajectory.

14. The system of claim 13 , wherein the imaging is between a first surface of the wafer to an opposite second surface of the wafer.

Assignees

• Kla Tencor Corp

Inventors

• Horn Paul

Classifications

• G01N21/9503 Primary

  Wafer edge inspection · CPC title