Conductive adhesive tape and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9718994-B2
Application number	US-201414560188-A
Country	US
Kind code	B2
Filing date	Dec 4, 2014
Priority date	Jun 4, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

First claim

The invention claimed is:

1. A conductive adhesive tape comprising:
a substrate formed of a polymer material in a nano-web form and having a number of pores, wherein the substrate is formed by spinning the polymer material; and
an electrical conductive adhesive layer formed directly on the substrate, the electrical conductive adhesive layer being formed of an electrical conductive adhesive material in a non-porous form, the electrical conductive adhesive material being absorbed into and filled in the pores of the substrate, wherein the electrical conductive adhesive layer is formed by spinning the electrical conductive adhesive material.

2. The conductive adhesive tape according to claim 1 , wherein the spinning includes any one of electrospinning, air-electrospinning (AES), electrospray, electrobrown spinning, centrifugal electrospinning, and flash-electrospinning.

3. The conductive adhesive tape according to claim 1 , wherein the electrical conductive adhesive material comprises any one of an electrically conductive metal, carbon black, carbon nanotube, graphene and conductive polymer (PDOT), and an adhesive.

4. The conductive adhesive tape according to claim 1 , wherein the electrical conductive adhesive layer comprises a first electrical conductive adhesive layer formed on one surface of the substrate, and a second electrical conductive adhesive layer formed on the other surface of the substrate, the one surface being opposite to the other surface.

5. The conductive adhesive tape according to claim 4 , wherein the first electrical conductive adhesive layer and the second electrical conductive adhesive layer have different adhesive strengths.

6. The conductive adhesive tape according to claim 5 , further comprising a first release film formed on a surface of the first electrical conductive adhesive layer, and a second release film formed on a surface of the second electrical conductive adhesive layer, wherein the first release film and the second release film are formed of different materials having different peeling strengths.

7. The conductive adhesive tape according to claim 4 , further comprising an electromagnetic wave shielding layer formed between the second electrical conductive adhesive layer and the substrate.

8. The conductive adhesive tape according to claim 7 , wherein the electromagnetic wave shielding layer is formed by depositing a conductive metallic material on a surface of the substrate.

9. The conductive adhesive tape according to claim 4 , further comprising:
a non-porous film layer that is formed between the substrate and the first electrical conductive adhesive layer.

10. The conductive adhesive tape according to claim 9 , further comprising a second substrate that is formed between the non-porous film layer and the first electrical conductive adhesive layer.

Assignees

• Amogreentech Co Ltd

Inventors

• Lee Seung Hoon
• Jung Yong Sik
• So Yun Mi

Classifications

• C09J2400/263

  in the substrate · CPC title

• C09J7/041

  Chemistry & Metallurgy · mapped topic

• C09J7/0296

  Chemistry & Metallurgy · mapped topic

• C09J2201/134

  Chemistry & Metallurgy · mapped topic

• C09J2205/102

  Chemistry & Metallurgy · mapped topic