Polymer thick film silver conductor with inverted cure profile behavior

Patent metadata

Field	Value
Publication number	US-9718966-B2
Application number	US-201514736791-A
Country	US
Kind code	B2
Filing date	Jun 11, 2015
Priority date	Jul 15, 2014
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

This invention is directed to a polymer thick film conductor composition that provides a better conductor when dried at 80° C. than when dried at 130° C., in contrast to typical PTF conductors. More specifically, the polymer thick film conductor may be used in applications where low temperature curing is required.

First claim

What is claimed is:

1. A polymer thick film conductor composition, comprising:
(a) 30-90 wt % of a conductive powder comprising silver powder and up to 1 wt % of the total composition additional metal powder or conductive carbon powder; and
(b) 10-70 wt % organic medium comprising 10-60 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 40-90 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium;

wherein said conductive powder is dispersed in said organic medium, wherein the weight percent of said conductive powder and said organic medium are based on the total weight of said polymer thick film conductor composition, and wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature less than 90° C.

2. The polymer thick film conductor composition of claim 1 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof, wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature of 80° C.

3. The polymer thick film conductor composition of claim 1 , said silver powder comprising silver flakes, wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature of 80° C.

4. The polymer thick film conductor composition of claim 1 , said silver powder comprising a mixture of silver flakes and silver-coated copper particles, wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature of 80° C.

5. The polymer thick film conductor composition of claim 1 , comprising:
(a) 40-80 wt % conductive powder; and
(b) 20-60 wt % organic medium, wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature of 80° C.

6. The polymer thick film conductor composition of claim 5 , comprising:
(a) 58-70 wt % conductive powder; and
(b) 30-42 wt % organic medium, wherein a polymer thick film conductor can be formed by drying the polymer thick film conductor composition at a temperature of 80° C.

7. The polymer thick film conductor composition of claim 5 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof.

8. The polymer thick film conductor composition of claim 1 , said organic medium comprising 20-45 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 55-80 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium.

9. The polymer thick film conductor composition of claim 8 , said organic medium comprising 25-35 wt % thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin dissolved in 65-75 wt % organic solvent consisting of triethyl phosphate, wherein the weight percent of said thermoplastic vinylidene difluoride/hexafluoro propylene copolymer resin and said triethyl phosphate organic solvent are based on the total weight of said organic medium.

10. The polymer thick film conductor composition of claim 8 , said silver powder comprising particles selected from the group consisting of silver flakes, silver-coated copper particles and mixtures thereof.

Assignees

• Du Pont

Inventors

• Dorfman Jay Robert

Classifications

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• C08K3/08 Primary

  Metals · CPC title

• C09D11/52

  Electrically conductive inks · CPC title

• C09D127/16

  Homopolymers or copolymers of vinylidene fluoride · CPC title

• C08K2003/0806

  Silver · CPC title