Semiconductor structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9718677-B1
Application number	US-201615000521-A
Country	US
Kind code	B1
Filing date	Jan 19, 2016
Priority date	Jan 19, 2016
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

In the present disclosure a semiconductor device comprises a plate including a plurality of apertures. The semiconductor device also comprises a membrane disposed opposite to the plate and including a plurality of corrugations, a dielectric surrounding and covering an edge of the membrane, and a substrate. The semiconductor device further includes a metallic conductor comprising a first portion extending through the dielectric, and a second portion over the substrate, where the second portion is bonded with the first portion.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a plate including a plurality of apertures;
a membrane disposed opposite to the plate and including a plurality of corrugations on a surface;
a first dielectric surrounding and covering an edge of the membrane;
a substrate;
a second dielectric between the substrate and the first dielectric; and
a metallic conductor, comprising
a first portion extending through the first dielectric along a first central axis of the first portion; and
a second portion over the substrate, an end of the second portion extending through the second dielectric along a second central axis of the end, wherein the second portion is bonded with the first portion and the second central axis is offset from the first central axis.

2. The semiconductor device of claim 1 , wherein the membrane is configured to be displaceable relative to the plate.

3. The semiconductor structure of claim 1 , wherein the membrane is within a cavity defined by the plate and the membrane.

4. The semiconductor structure of claim 1 , wherein the first portion conductor includes one of gold, tin, silicon, copper and tin copper alloy.

5. The semiconductor structure of claim 1 , wherein the second portion conductor includes one of gold, tin, silicon, copper and tin copper alloy.

6. The semiconductor structure of claim 1 , wherein the membrane is sensitive to an acoustic pressure.

7. The semiconductor structure of claim 1 , wherein the first portion conductor is electrically coupled to the membrane.

8. The semiconductor structure of claim 1 , wherein the plate comprises a silicon-on-insulator layer, polysilicon, oxide, or epitaxial silicon.

9. The semiconductor structure of claim 1 , wherein the second portion conductor is configured as a loop.

10. The semiconductor structure of claim 1 , wherein each of the plurality of corrugations is protruded from membrane and toward the plate.

11. A monolithic sensor, comprising:
a micro-electro mechanical system (MEMS) device comprising:
a plate including a plurality of apertures;
a membrane disposed opposite to the plate and including a plurality of corrugations;
a first conductor disposed below the plate and extending along a first central axis of the first conductor, and
a first cavity between the plate and the membrane; and

a complementary metal oxide semiconductor (CMOS) device comprising:
a substrate;
an interconnect disposed over the substrate and
a second conductor electrically coupled to the interconnect and extruded from the interconnect toward the membrane along a second central axis of the second conductor, wherein the first conductor is connected with the second conductor in a metal bond manner and the first central axis is in parallel but not aligned with the second central axis.

12. The monolithic sensor of claim 11 , wherein a total thickness from the MEMS to the CMOS device is less than about 200 um.

13. The monolithic sensor of claim 11 , wherein the plate is stationary and the membrane is movable within the first cavity and relative to the plate.

14. The monolithic sensor of claim 11 , wherein the MEMS device includes a dielectric disposed around a peripheral portion of the membrane.

15. The monolithic sensor of claim 11 , wherein the CMOS device includes a dielectric between the interconnect and the first conductor, wherein a portion of the second conductor is partially interposed between the interconnect and the first conductor.

16. The monolithic sensor of claim 11 , wherein the plate has a thickness of about 0.3 um to about 50 um.

17. The monolithic sensor of claim 11 , wherein the plate is disposed away from the membrane in a distance of about 0.1 um to about 5 um.

18. A semiconductor device, comprising:
a plate including a plurality of apertures;
a movable membrane including a plurality of corrugations;
a first cavity between the plate and the movable membrane;
a substrate;
a first dielectric between the plate and the substrate;
a metallic conductor, comprising
a first portion being in contact with the first dielectric; and
a second portion over the substrate, wherein the second portion is bonded with the first portion, wherein a central axis shared by the first portion and the second portion staggers conformally to the first portion and the second portion.

19. The semiconductor device of claim 18 , wherein a sidewall of the first portion is partially exposed from the first dielectric.

20. The semiconductor device of claim 18 , further comprising a second dielectric between the substrate and the first dielectric, wherein the second portion is surrounded by the second dielectric.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chang Yi-Hsien
• Cheng Chun-Ren

Classifications

• B81B3/0027 Primary

  Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation · CPC title

• H04R7/14

  corrugated, pleated or ribbed · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81C2201/0174

  for making multi-layered devices, film deposition or growing · CPC title

• B81B2203/0127

  Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function · CPC title