Method of fabricating a nanochannel system for DNA sequencing and nanoparticle characterization

Patent metadata

Field	Value
Publication number	US-9718668-B2
Application number	US-201313951664-A
Country	US
Kind code	B2
Filing date	Jul 26, 2013
Priority date	Feb 16, 2012
Publication date	Aug 1, 2017
Grant date	Aug 1, 2017

Abstract

A process for fabricating a nanochannel system using a combination of microelectromechanical system (MEMS) microfabrication techniques, atomic force microscopy (AFM) nanolithography, and focused ion beam (FIB). The nanochannel system, fabricated on either a glass or silicon substrate, has channel heights and widths on the order of single to tens of nanometers. The channel length is in the micrometer range. The nanochannel system is equipped with embedded micro and nanoscale electrodes, positioned along the length of the nanochannel for electron tunneling based characterization of nanoscale particles in the channel. Anodic bonding is used to cap off the nanochannel with a cover chip.

First claim

What is claimed is:

1. A method of fabricating a nanochannel system comprising the steps of:
(a) micropatterning a substrate to form at least one electrode;
(b) micropatterning said substrate to form a first microchannel portion and a second microchannel portion;
(c) machining a nanochannel between said first microchannel portion and said second microchannel portion; and
(d) bonding a cover chip to said substrate.

2. The method of claim 1 , wherein said substrate is a silicon chip.

3. The method of claim 1 , wherein said at least one electrode is a microelectrode.

4. The method of claim 1 , wherein said at least one electrode is a nanoelectrode.

5. The method of claim 1 , wherein said substrate comprises a silicon oxide layer.

6. The method of claim 1 , wherein said step of machining causes said at least one electrode to be dissected into at least two microelectrodes.

7. The method of claim 1 , wherein said step of machining comprises the step of using atomic force microscopy nanolithography.

8. The method of claim 1 , wherein said step of machining is performed by a cutting tool, wherein said cutting tool comprises a diamond probe tip with a large spring constant and a nanoscale tip radius, wherein said diamond probe tip is mounted on a cantilever.

9. The method of claim 1 , wherein said cover chip is a glass cover chip.

10. The method of claim 1 , wherein said bonding is anodic bonding.

11. The method of claim 1 , wherein said at least one electrode comprises five electrodes.

12. The method of claim 1 , wherein said first microchannel portion is an inlet to said nanochannel and said second microchannel portion is an outlet from said nanochannel.

13. The method of claim 12 , wherein said inlet comprises an inlet reservoir and said outlet comprises an outlet reservoir.

14. The method of claim 1 , wherein said step of bonding a cover chip to said substrate comprises the steps of:
(a) placing said substrate on a hot plate;
(b) linking said substrate to an anode of a current supply;
(c) placing said cover chip on top of said substrate;
(d) linking said cover chip to a cathode of said current supply; and
(e) providing a temperature of said hot plate and a voltage of said current supply sufficient to cause bonding between said substrate and said cover chip.

15. A method of fabricating a nanochannel system comprising the steps of:
(a) micropatterning a first glass substrate to form a first microelectrode and a second microelectrode;
(b) micropatterning said first glass substrate to form a first microchannel portion and a second microchannel portion;
(c) depositing a nanoelectrode on said glass substrate between said first microelectrode and said second microelectrode;
(d) machining a nanochannel between said first microchannel portion and said second microchannel portion;
(e) bonding a second glass substrate to said first glass substrate.

16. The method of claim 15 , wherein said step of micropatterning said first glass substrate to form a first microchannel portion and a second microchannel portion comprises the step of using photolithography and wet etching.

17. The method of claim 15 , wherein said step of depositing a nanoelectrode on said first glass substrate comprises the step of using focused ion beam.

18. The method of claim 15 , wherein said step of machining a nanochannel between said first microchannel portion and said second microchannel portion comprises the step of using atomic force microscopy nanolithography and focused ion beam.

19. The method of claim 15 , wherein said bonding is anodic bonding.

20. The method of claim 15 , wherein said second glass substrate comprises amorphous silicon.

Assignees

• Tung Chao-Hung Steve
• Kim Jin-Woo
• Busch Taylor
• Univ Arkansas

Inventors

• Tung Chao-Hung Steve
• Kim Jin-Woo
• Busch Taylor

Classifications

• C03C27/00

  Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing (C03C17/00 takes precedence; layered structures comprising at least one glass sheet B32B17/00; wired glass C03B; joining glass to ceramics C04) · CPC title

• B81B1/00 Primary

  Devices without movable or flexible elements, e.g. microcapillary devices · CPC title

• G01N27/44791

  Microapparatus (sample containers with integrated microfluidic structures B01L3/5027) · CPC title

• B82Y15/00

  Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors · CPC title

• C12Q1/6869 Primary

  Methods for sequencing · CPC title