Cover glass for covering a camera of an electronic device

Patent metadata

Field	Value
Publication number	US-9716815-B2
Application number	US-201514875402-A
Country	US
Kind code	B2
Filing date	Oct 5, 2015
Priority date	Dec 11, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

An electronic device can include a camera and a cover glass arrangement disposed over the camera. The cover glass arrangement includes a thinner region or cover glass that is positioned over a light-receiving region of the camera. Additionally, the thinner region or cover glass can be disposed over the light-receiving region and at least parts of one or more non-light receiving regions of the camera.

First claim

What is claimed is:

1. An electronic device, comprising:
an enclosure;
a camera positioned within the enclosure;
a cover attached to the enclosure and defining:
an exterior surface of the electronic device; and
an opening aligned with a light-receiving region of the camera; and

a camera cover in the opening and having a thickness different than a thickness of the cover.

2. The electronic device of claim 1 , wherein the camera cover is thinner than the cover.

3. The electronic device of claim 1 , wherein the camera cover comprises a lens in optical communication with the light-receiving region of the camera.

4. The electronic device of claim 1 , wherein:
the cover is formed from glass; and
the camera cover is formed from sapphire.

5. The electronic device of claim 1 , wherein the opening extends through a complete thickness of the cover.

6. The electronic device of claim 1 , wherein the exterior surface of the electronic device is a rear surface of the electronic device that is opposite a display surface of the electronic device.

7. An electronic device, comprising:
a camera;
a cover layer defining a portion of an external surface of the electronic device and having an opening therethrough, the cover layer comprising a first transparent material;
a camera cover disposed in the opening and comprising a second transparent material different than the first transparent material; and
a display device covered by at least a portion of the cover layer.

8. The electronic device of claim 7 , wherein:
the portion of the external surface is a first portion of the external surface; and
the camera cover defines a second portion of the external surface that is substantially flush with the first portion of the external surface.

9. The electronic device of claim 8 , wherein:
the camera cover is thinner than the transparent cover layer; and
at least a portion of the camera extends at least partially into the opening.

10. The electronic device of claim 7 , wherein the camera cover is formed from sapphire.

11. The electronic device of claim 7 , wherein at least part of the camera extends into the opening.

12. A cover assembly for an electronic device, comprising:
a cover having a first thickness, configured to form an exterior surface of the electronic device, and defining an opening in a location corresponding to a lens of a camera in the electronic device; and
a lens cover configured to be positioned within the opening and having a second thickness different than the first thickness.

13. The cover assembly of claim 12 , wherein:
the second thickness is smaller than the first thickness;
an exterior surface of the lens cover is substantially flush with an exterior surface of the cover when installed on the electronic device; and
an interior surface of the lens cover is recessed relative to an interior surface of the cover glass when installed on the electronic device.

14. The cover assembly of claim 12 , further comprising a bracket coupling the lens cover to the cover.

15. The cover assembly of claim 12 , wherein:
the cover is formed from a first transparent material; and
the lens cover is formed from a second transparent material different than the first transparent material.

16. The cover assembly of claim 15 , wherein the second transparent material is sapphire.

17. A method for producing an electronic device, comprising:
positioning a cover layer having a first thickness on an enclosure such that an opening through the cover layer is aligned with a light-receiving region of a camera in the electronic device and at least a portion of the camera is at least partially in the opening; and
disposing a lens cover having a second thickness different than the first thickness in the opening.

18. The method of claim 17 , further comprising providing the camera in the enclosure.

19. The method of claim 17 , wherein the operation of positioning the cover layer on the enclosure is performed after the operation of disposing the lens cover in the opening.

20. The method of claim 17 , further comprising forming the opening through the cover layer.

Assignees

• Apple Inc

Inventors

• Kwong Kelvin
• Hooton Lee E
• Havskjold David G
• Montevirgen Anthony S
• Sanford Emery A

Classifications

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F1/1686

  the I/O peripheral being an integrated camera · CPC title

• G06F3/044

  by capacitive means · CPC title

• G06F3/0414

  using force sensing means to determine a position · CPC title