Semiconductor device and semiconductor device fabrication method
US-2016372392-A1 · Dec 22, 2016 · US
Wire connecting method and terminal
US9716077B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9716077-B2 |
| Application number | US-201615227601-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 3, 2016 |
| Priority date | Sep 11, 2015 |
| Publication date | Jul 25, 2017 |
| Grant date | Jul 25, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includes an insulator interposed between a first conductor and a second conductor. The part of the terminal held in the positioning of the terminal includes a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap. The laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of connecting a wire with a terminal including a plurality of conductors, the method comprising: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of the plurality of conductors, which is exposed on a surface of the positioned terminal, wherein the terminal comprises a laminate structure that comprises an insulator interposed between a first conductor and a second conductor, the part of the terminal held in the positioning of the terminal comprises a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap, and the laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.
Assignees
Inventors
Classifications
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
changes in dispositions · CPC title
Means for aligning · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
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Frequently asked questions
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- What does patent US9716077B2 cover?
- A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includ…
- Who is the assignee on this patent?
- Toyota Motor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/451. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).