Universal clamping fixture to maintain laminate flatness during chip join

Patent metadata

Field	Value
Publication number	US-9716028-B2
Application number	US-201514840001-A
Country	US
Kind code	B2
Filing date	Aug 30, 2015
Priority date	Feb 26, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.

First claim

What is claimed is:

1. A method of manufacturing a clamping apparatus for maintaining a workpiece flatness during processing, comprising:
mounting two sets of clamping mechanisms on a base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing configured to be in overlapping relation to a first workpiece, each set of the clamp heads extending below the rod, and being in spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and
coupling a biasing member including a spring washer to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure transmitted only by the clamp heads to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane; and
wherein the mounting two sets of clamping mechanisms on the base comprises:
positioning a shaft integral to each housing through the base from a top side of the base.

Assignees

• IBM

Inventors

• Merte Donald A
• Weiss Thomas

Classifications

• H10W72/07178

  Means for aligning · CPC title

• H10P72/7622

  characterised by supporting substrates others than wafers, e.g. chips · CPC title

• H10P72/7608 Primary

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7606 Primary

  characterised by edge clamping, e.g. clamping ring · CPC title

• B23Q3/061

  adapted for holding a plurality of workpieces · CPC title