Systems and methods for simulations of reliability in printed circuit boards

Patent metadata

Field	Value
Publication number	US-9715571-B1
Application number	US-201514875799-A
Country	US
Kind code	B1
Filing date	Oct 6, 2015
Priority date	Oct 8, 2014
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

Systems and methods are provided for simulations of printed circuit boards (PCBs). Geometry data related to a PCB is determined from layout data associated with the PCB. A finite element mesh is generated based at least in part on the geometry data related to the PCB, the finite element mesh including one or more mesh components. One or more conductors passing through the one or more mesh components are identified. A volume fraction of the one or more conductors within the one or more mesh components is computed. One or more physical properties of the one or more mesh components are adjusted based at least in part on the volume fraction.

First claim

The invention claimed is:

1. A computer-implemented method for simulations of printed circuit boards (PCBs), the method comprising:
determining, using one or more data processors, geometry data related to a PCB from layout data associated with the PCB, the layout data being stored in one or more non-transitory computer readable storage media;
generating, using the one or more data processors, a finite element mesh based at least in part on the geometry data related to the PCB, the finite element mesh including a plurality of mesh components;
identifying, using the one or more data processors, one or more conductors passing through a first mesh component of the plurality of mesh components;
computing, using the one or more data processors, a conductor fraction associated with portions of the one or more conductors contained within the first mesh component; and
adjusting, using the one or more data processors, a physical property of the first mesh component based at least in part on the conductor fraction.

2. The method of claim 1 , wherein the geometry data includes geometry of the PCB and geometry of the one or more conductors.

3. The method of claim 1 , wherein the generating a finite element mesh based at least in part on the geometry data related to the PCB includes:
discretizing the geometry data.

4. The method of claim 1 , wherein the one or more mesh components have polygonal shapes.

5. The method of claim 1 , wherein the one or more conductors are identified using a fast octree search algorithm.

6. The method of claim 1 , wherein the conductor fraction of the first mesh component includes distinct X, Y, and Z components each associated with one of three orthogonal directions.

7. The method of claim 6 , wherein adjusting the physical property includes adjusting three distinct X, Y, and Z components of the physical property.

8. The method of claim 1 , wherein the PCB includes one or more layers each layer comprising of dielectric material and conductors.

9. The method of claim 8 , wherein the generating a finite element mesh based at least in part on the geometry data related to the PCB includes:
generating distinct mesh components for each layer of the PCB each having a thickness property for a given temperature equivalent to a respective PCB layer thickness for the given temperature, wherein the thickness is measured along a line perpendicular to each layer of the PCB.

10. The method of claim 8 , wherein the generating a finite element mesh based at least in part on the geometry data related to the PCB includes:
generating mesh components to encompass a portion of multiple layers and having a thickness property for a given temperature equivalent to an aggregated thickness of the multiple layers for a given temperature, wherein the thickness is measured along a line perpendicular to each layer of the PCB.

11. The method of claim 1 , further comprising:
performing a thermal analysis on the PCB to determine temperature-related data;
interpolating the temperature-related data onto the finite element mesh; and
adjusting the one or more physical properties of the one or more mesh components based at least in part on the temperature-related data.

12. The method of claim 1 , further comprising:
performing deflection calculation through simulations.

13. The method of claim 1 , wherein the physical properties include thermal properties and structural properties.

14. The method of claim 1 further comprising:
identifying, using the one or more data processors, second one or more conductors passing through a second mesh component of the plurality of mesh components;
computing, using the one or more data processors, a second conductor fraction associated with the second one or more conductors as of the second mesh component; and
adjusting, using the one or more data processors, the physical property of the second mesh component based at least in part on the second conductor fraction, wherein the second conductor fraction is different than the first conductor fraction and the physical property of the first mesh component is different than the physical property of the second mesh component.

15. The method of claim 1 wherein adjusting the physical property results in the physical property having orthotropic values that differ in each of three mutually orthogonal directions.

16. A processor-implemented system for simulations of printed circuit boards (PCBs), the system comprising:
one or more data processors; and
one or more non-transitory computer-readable storage media encoded with instructions for commanding the one or more data processors to execute operations including:
determine geometry data related to a PCB from layout data associated with the PCB;
generate a finite element mesh based at least in part on the geometry data related to the PCB, the finite element mesh including a plurality of mesh components;
identify one or more conductors passing through a first mesh component of the plurality of mesh components;
compute a conductor fraction associated with portions of the one or more conductors contained within the first mesh component; and

adjust one or more physical properties of the first mesh component based at least in part on the conductor fraction.

17. The system of claim 16 , wherein the geometry data includes geometry of the PCB and geometry of the one or more conductors.

18. The system of claim 16 , wherein the one or more conductors are identified using a fast octree search algorithm.

19. The system of claim 16 , wherein the conductor fraction of the first mesh component for includes distinct X, Y, and Z components each of associated with one of three orthogonal directions.

20. The system of claim 16 , wherein the instructions are adapted for commanding the one or more data processors to execute further operations including:
determine a number of layers of the PCB; and
determine a uniform grid for each layer of the PCB.

21. The system of claim 16 , wherein the instructions are adapted for commanding the one or more data processors to execute further operations including:
determine a layered grid for the PCB.

22. The system of claim 16 , wherein the instructions are adapted for commanding the one or more data processors to execute further operations including:
performing a thermal analysis on the PCB to determine temperature-related data;
interpolating the temperature-related data onto the finite element mesh; and
adjusting the one or more physical properties of the one or more mesh components based at least in part on the temperature-related data.

23. A non-transitory machine-readable storage medium encoded with instructions for
commanding one or more data processors to execute operations of a method for simulations of printed circuit boards (PCBs), the method comprising:
determining geometry data related to a PCB from layout data associated with the PCB;
generating a finite element mesh based at least in part on the geometry data related to the PCB, the finite element mesh including a plurality of mesh components;
identifying one or more conductors passing through a first mesh component of the plurality of mesh components;
computing a conductor fraction associated with portions of the one or more conductors contained within the first mesh component; and
adjusting one or more physical properties of the first mesh component based at least in part on the conductor fraction.

Assignees

• Sas Ip Inc
• Ansys Inc

Inventors

• Rath Rajiv Lochan
• Yaddanapudi Vamsi Krishna
• Adhiya Ankit

Classifications

• G06F30/23 Primary

  using finite element methods [FEM] or finite difference methods [FDM] · CPC title

• G06F30/20

  Design optimisation, verification or simulation (optimisation, verification or simulation of circuit designs G06F30/30) · CPC title

• G06F17/5081 Primary

  Physics · mapped topic

• G06F17/5009

  Physics · mapped topic

• G06F30/398 Primary

  Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] (optical proximity correction [OPC] design processes G03F1/36) · CPC title