Semiconductor strain gauge

Patent metadata

Field	Value
Publication number	US-9714876-B2
Application number	US-201514669297-A
Country	US
Kind code	B2
Filing date	Mar 26, 2015
Priority date	Mar 26, 2015
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

Methods and apparatus for a semiconductor strain gauge pressure sensor. An apparatus includes a sense element configured to be exposed to a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge including a five pad single full Wheatstone bridge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that comprises the sense element, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

First claim

What is claimed is:

1. An apparatus comprising:
a sense element configured to sense pressure in a pressure environment, the sense element including at least one highly doped semiconductor strain gauge, the highly doped semiconductor strain gauge comprising a five pad single full Wheatstone bridge; and
a printed circuit board disposed on a substrate and electrically coupled to the sense element, the substrate bonding the sense element on a port body,
wherein the five pad single full Wheatstone bridge includes:
a centrally positioned ground pad between a first voltage supply pad and a second voltage supply pad;
a peripherally positioned first bridge output pad, the first voltage supply pad separating the first bridge output pad from the ground pad; and
a peripherally positioned second bridge output pad, the second voltage supply pad separating the second bridge output pad from the ground pad.

2. The apparatus of claim 1 wherein the highly doped semiconductor strain gauge further comprises an insulation layer on a sidewall for at least partially isolating the Wheatstone bridge from the substrate.

3. The apparatus of claim 2 wherein the insulation layer comprises silicon mononitride (SiN).

4. The apparatus of claim 2 wherein the insulation layer comprises silicon nitride (Si 3 N 4 ).

5. The apparatus of claim 1 wherein the five pad single full Wheatstone bridge further comprises four piezoresistive resisters.

6. The apparatus of claim 1 wherein the first bridge output pad, the first voltage supply pad, the ground pad, the second voltage supply pad and the second bridge output pad are aligned in a same orientation and parallel arrayed.

7. An apparatus for sensing a pressure of an environment comprising:
a port body having a diaphragm and defining an inner borehole, the inner borehole configured to expose the diaphragm to the environment;
a five pad single full Wheatstone bridge disposed on top of the port body and having a longitudinal and transverse axis, the five pad single full Wheatstone bridge having the following aligned in a parallel row along the longitudinal axis: a first bridge output pad; a first voltage supply pad; a ground pad, the transverse axis running through the center of the ground pad; a second voltage supply pad; and a second bridge output pad;
a plurality of piezoresistive elements oriented within the five pad single Wheatstone bridge; and
a printed circuit board disposed on a substrate and electrically coupled to the five pad single full Wheatstone bridge,
wherein the longitudinal and transverse axis intersect to form a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant.

8. The apparatus of claim 7 wherein: the first and fourth quadrants are disposed above the port body such that pressure from the pressure environment causes the first and fourth quadrants to be in compression; and the second and third quadrants are disposed above the diaphragm such that pressure from the pressure environment causes the second and third quadrants to be in tension.

9. The apparatus of claim 8 wherein the plurality of piezoresistive elements includes: a first resistor oriented in the first quadrant; a second resistor in the second quadrant; a third resistor in the third quadrant; and a fourth resistor in the fourth quadrant.

10. The apparatus of claim 9 wherein the substrate is glass.

11. The apparatus of claim 7 wherein the five pad single full Wheatstone bridge has a plurality of sidewalls, the sidewalls being separated from the substrate by an insulation layer for at least partially isolating the Wheatstone bridge from the substrate.

12. The highly doped semiconductor strain gauge of claim 11 wherein the insulation layer comprises silicon mononitride (SiN).

13. The highly doped semiconductor strain gauge of claim 11 wherein the insulation layer comprises silicon nitride (Si 3 N 4 ).

Assignees

• Sensata Technologies Inc

Inventors

• Huo Shihong
• Bousquet Cory
• Goncalves Daniel

Classifications

• G01L9/0042 Primary

  Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively) · CPC title

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• G01R17/00

  Measuring arrangements involving comparison with a reference value, e.g. bridge · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title