Metrology method and apparatus, lithographic system, device manufacturing method and substrate

Patent metadata

Field	Value
Publication number	US-9714827-B2
Application number	US-201314412771-A
Country	US
Kind code	B2
Filing date	Jun 17, 2013
Priority date	Jul 5, 2012
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A lithographic process is used to form a plurality of target structures ( 92, 94 ) distributed at a plurality of locations across a substrate and having overlaid periodic structures with a number of different overlay bias values distributed across the target structures. At least some of the target structures comprise a number of overlaid periodic structures (e.g., gratings) that is fewer than said number of different overlay bias values. Asymmetry measurements are obtained for the target structures. The detected asymmetries are used to determine parameters of a lithographic process. Overlay model parameters including translation, magnification and rotation, can be calculated while correcting the effect of bottom grating asymmetry, and using a multi-parameter model of overlay error across the substrate.

First claim

What is claimed is:

1. A method comprising:
forming a plurality of target structures distributed at a plurality of locations across a substrate and having overlaid periodic structures with a number of different overlay bias values distributed across said target structures, at least some of the target structures comprising a number of overlaid periodic structures that is fewer than said number of different overlay bias values;
illuminating the target structures;
detecting asymmetries in the radiation scattered by said target structures; and
determining a plurality of overlay parameters based on the detected asymmetries of three or more target structures distributed at different locations across the substrate and having three or more different respective values of overlay bias to determine said parameters using knowledge of the three different overlay bias values.

2. The method as claimed in claim 1 wherein the determining parameters based on the detected asymmetries includes an assumed non-linear relationship between overlay error and asymmetry.

3. A method as claimed in claim 1 wherein the determining parameters based on the detected asymmetries comprises using a multi-parameter model of overlay error across the substrate.

4. The method as claimed in claim 3 wherein said multi-parameter model of overlay error comprises parameters representing translation, magnification, rotation and substrate coordinates.

5. The method as claimed in claim 4 wherein said multi-parameter model of overlay error is an at least-six-parameter model.

6. The method as claimed in claim 2 , wherein said assumed non-linear relationship is either a sinusoidal function or a combination of sinusoidal functions related harmonically to one another.

7. The method as claimed in claim 1 wherein the determining parameters based on the detected asymmetries is performed with the assumption that a contribution to overall asymmetry due to feature asymmetry within one or more of said periodic structures is constant for all values of overlay.

8. The method as claimed in claim 2 wherein the determining parameters based on the detected asymmetries is performed with the assumption that a contribution to overall asymmetry due to feature asymmetry within one or more of said periodic structures and one or more harmonic proportionality constant describing the assumed non-linear relationship are floating.

9. The method as claimed in claim 1 wherein the different overlay bias values span a range greater than 4%, 10%, 15%, or 20%, of a respective pitch of said periodic structures.

10. A method of manufacturing devices wherein a device pattern is applied to a series of substrates using a lithographic process, the method comprising:
inspecting at least one periodic structure formed as part of or beside said device pattern on at least one of said substrates, the inspecting comprising,
forming, via a lithographic process, a plurality of target structures distributed at a plurality of locations across a substrate and having overlaid periodic structures with a number of different overlay bias values distributed across said target structures, at least some of the target structures comprising a number of overlaid periodic structures that is fewer than said number of different overlay bias values;
illuminating the target structures;
detecting asymmetries in the radiation scattered by said target structures;
determining a plurality of overlay parameters based on the detected asymmetries of three or more target structures distributed at different locations across the substrate and having three or more different respective values of overlay bias to determine said parameters using knowledge of the three different overlay bias values, and
controlling the lithographic process for later substrates in accordance with the result of the method.

Assignees

• Asml Netherlands Bv

Inventors

• Van Der Schaar Maurits
• Bhattacharyya Kaustuve
• Smilde Hendrik-Jan Hidde

Classifications

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• G01B11/30

  for measuring roughness or irregularity of surfaces · CPC title

• G03F7/70633 Primary

  Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G01B11/27 Primary

  for testing the alignment of axes {(means for centering or aligning a light guide within a ferrule G02B6/3834)} · CPC title