Solvent assisted processing to control the mechanical properties of electrically and/or thermally conductive polymer composites

Patent metadata

Field	Value
Publication number	US-9714370-B2
Application number	US-201314037991-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Sep 26, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

Electrically and/or thermally conductive polymer composites and methods of preparing same are provided. In some embodiments, a method for preparing an electrically and/or thermally conductive polymer composite may include (1) mixing a polymer, a conductive particulate filler, and a solvent to form a non-conductive polymer solution or melt; (2) processing, the non-conductive polymer solution or melt to form a non-conductive polymer network composition; wherein the presence of solvent during three-dimensional network formation manipulates the polymer network structure; and (3) removing the solvent from the non-conductive polymer network composition to form an electrically and/or thermally conductive polymer composite. The altered polymer chain structure present in the non-conductive polymer network composition is maintained in the composite, and offsets the impact of particulate filler addition including increased modulus, decreased elasticity, and decreased elongation at break. This method enables development of composite materials with electrical/thermal and mechanical performance that can be tailored independently.

First claim

The invention claimed is:

1. A method of forming an electrically and/or thermally conductive polymer composite, comprising:
mixing a polymer, a conductive particulate filler, and a solvent compatible with the polymer to form a non-conductive polymer solution or melt; wherein the conductive particulate filler is electrically conductive, thermally conductive, or both; wherein the amount of conductive particulate filler in the non-conductive polymer solution or melt is below the mechanical percolation threshold and the electrical/thermal percolation threshold of the conductive particulate filler therein;
processing the non-conductive polymer solution or melt to form a non-conductive polymer network composition, wherein the polymers in said non-conductive polymer network composition are physically cross linked or a combination of physically and chemically cross linked;
retaining said solvent to adjust a structure of the polymer network and the mechanical properties of said electrically and/or thermally conductive polymer formed through curing; and
finally removing said solvent from the non-conductive polymer network composition to concentrate the polymers therein and the conductive particulate filler therein to form an electrically and/or thermally conductive polymer composite.

2. The method of claim 1 , wherein the polymers in said non-conductive polymer network composition are physically cross linked.

3. The method of claim 1 , wherein the polymers in said non-conductive polymer network composition are a combination of physically and chemically cross linked polymer chains.

4. The method of claim 1 , wherein the polymer mixed with said conductive particulate filler and said solvent to form said non-conductive polymer solution or melt is an elastomeric polymer.

5. The method of claim 4 , wherein said elastomeric polymer is selected from the group consisting of poly(styrene-b-ethylene-co-butylene-b-styrene), poly(styrene-b-isoprene-b-styrene), poly(styrene-b-butadiene-b-styrene), natural rubber, polybutadiene, chloroprene, butyl rubber, nitrile rubber, silicone elastomer, fluorosilicone rubber, poly(propylene oxide) rubber, and epoxy elastomer.

6. The method of claim 1 , wherein the conductive particulate filler is at least one conductive particulate filler selected from the group consisting of, nickel spheres, graphene flakes, nickel flakes, gold flakes, silver flakes, or other metal flakes, nickel nanostrands, nickel coated carbon fibers, nickel coated carbon nanotubes, gold spheres, gold nanorods, silver spheres, silver nanorods, copper spheres, copper nanorods, carbon nanofiber, polyaniline, polythiophene, polyacetylene, polyphenylene sulfide, polyphenylene vinylene, aluminum nitride, aluminum oxide, beryllium oxide, boron nitride, diamond, gallium arsenide, glass, indium phosphide, sapphire and sodium chloride.

7. The method of claim 1 , wherein the amount of conductive particulate filler in the non-conductive polymer solution or melt is about 0.01 volume percent to about 55 volume percent.

8. The method of claim 1 , wherein the solvent is miscible with the polymer.

9. The method of claim 8 , wherein the solvent is at least one solvent selected from the group consisting of dibutyl phthalate, mineral oil, polydimethylsiloxane, water, acetone, methanol, ethanol, propanol, ethylhexanol, dodecane, decanol, cylcohexane, butanol, tetrahydrofuran, polydiethylsiloxane, chloroform, methylene chloride, ethylene glycol, methyl ethyl ketone, acetophenone, dimethyl sulfoxide, and bis-ethyl hexyl sebacate.

10. The method of claim 1 , wherein the amount of solvent in the non-conductive polymer solution or melt is about 10 volume percent to about 95 volume percent.

11. The method of claim 1 , wherein said method comprises removing about 10 volume percent to about 95 volume percent of the solvent from the non-conductive polymer network composition.

12. The method of claim 1 , further comprising extruding the non-conductive polymer network composition into a desired form.

13. The method of claim 1 , wherein the polymer present in said non-conductive polymer solution or melt is poly(styrene-b-ethylene-co-butylene-b-styrene),
wherein the solvent is mineral oil, and
wherein the conductive particulate filler is nickel-coated carbon fibers.

14. The method of claim 13 , wherein approximately 95% of the mineral oil is removed from the non-conductive polymer network composition.

Assignees

• U S Army Res Laboratory Attn: Rdrl-Loc-I
• Us Army

Inventors

• Mrozek Randy A
• Lenhart Joseph L

Classifications

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H01B1/24

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• H01B1/20

  Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} · CPC title