Polyglycolic acid support material for additive manufacturing systems

Patent metadata

Field	Value
Publication number	US-9714318-B2
Application number	US-201313951629-A
Country	US
Kind code	B2
Filing date	Jul 26, 2013
Priority date	Jul 26, 2013
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A support material for use in an additive manufacturing system, which compositionally includes a polyglycolic acid polymer, which is at least partially soluble in an aqueous solution, and which is configured for use in the additive manufacturing system for printing a support structure in coordination with printing of a three-dimensional part.

First claim

The invention claimed is:

1. A support material for use in an additive manufacturing system, the support material comprising:
a composition in a filament form or a powder form and comprising a polyglycolic acid polymer wherein the polyglycolic acid polymer comprises about 80% or more by weight of the composition, the polyglycolic acid polymer having at least one extension bonded to the PGA polymer, wherein the extension comprises:
a linkage group bonded to the PGA polymer wherein the linkage group is selected from the group consisting of an epoxy group, an isocyanate group, and an anhydride group prior to bonding with the PGA polymer wherein the linkage group comprises about 0.1% by weight to about 5% by weight of the composition; and
a terminal group bonded to the linkage group, wherein the terminal group comprises a polymer chain wherein the terminal group comprises about 1% by weight to less than about 20% by weight of the composition wherein the polymer chain of the terminal group is derived from a thermoplastic material selected from the group consisting of polyethersulfone polysulfone, polyphenylsulfone, polycarbonate, polyamide, and mixtures thereof;

wherein the support material is configured for use in the additive manufacturing system for printing a support structure from the support material in coordination with printing of a three-dimensional part and wherein the support material has a heat deflection temperature ranging from about 150° C. to less than about 220° C.; and
wherein the composition is at least partially soluble in an aqueous solution.

2. The support material of claim 1 , wherein the linkage group is bonded to the PGA polymer at a terminal location of the PGA polymer.

3. The support material of claim 1 , wherein the linkage group is bonded to a non-terminal monomer unit of the PGA polymer.

4. The support material of claim 1 , wherein the composition has a heat deflection temperature ranging from about 160° C. to about 175° C.

5. The support material of claim 1 , wherein the powder form has a particle size in the range of about 15 micrometers to about 125 micrometers.

6. The support material of claim 1 , wherein the polyglycolic acid polymer comprises between about 85% and 95% by weight of the composition.

7. The support material of claim 1 , wherein the linkage group comprises between about 0.2% and about 2.5% by weight of the composition.

8. The support material of claim 1 , wherein the terminal group comprises between about 5% and about 15% by weight of the composition.

9. A support material for use in an additive manufacturing system, the support material comprising:
a composition in a filament form or a powder form and comprising a polyglycolic acid polymer filled with carbon or glass, wherein the polyglycolic acid polymer comprises about 80% or more by weight of the composition, the polyglycolic acid polymer having at least one extension bonded to the PGA polymer, wherein the extension comprises:
a linkage group bonded to the PGA polymer wherein the linkage group is selected from the group consisting of an epoxy group, an isocyanate group, and an anhydride group prior to bonding with the PGA polymer wherein the linkage group comprises about 0.1% by weight to about 5% by weight of the composition; and
a terminal group bonded to the linkage group, wherein the terminal group comprises a polymer chain wherein the terminal group comprises about 1% by weight to less than about 20% by weight of the composition;
wherein the support material is configured for use in the additive manufacturing system for printing a support structure from the support material in coordination with printing of a three-dimensional part and wherein the support material has a heat deflection temperature ranging from about 150° C. to less than about 220° C.; and
wherein the composition is at least partially soluble in an aqueous solution.

10. The support material of claim 9 , wherein the linkage group is bonded to the PGA polymer at a terminal location of the PGA polymer.

11. The support material of claim 9 , wherein the linkage group is bonded to a non-terminal monomer unit of the PGA polymer.

12. The support material of claim 9 , wherein the polymer chain of the terminal group is derived from a thermoplastic material selected from the group consisting of polyethersulfone polysulfone, polyphenylsulfone, polycarbonate, polyamide, and mixtures thereof.

13. The support material of claim 9 , wherein the composition has a heat deflection temperature ranging from about 160° C. to about 175° C.

14. The support material of claim 9 , wherein the powder form has a particle size in the range of about 15 micrometers to about 125 micrometers.

15. The support material of claim 9 , wherein the polyglycolic acid polymer comprises between about 85% and 95% by weight of the composition.

16. The support material of claim 9 , wherein the linkage group comprises between about 0.2% and about 2.5% by weight of the composition.

17. The support material of claim 9 , wherein the terminal group comprises between about 5% and about 15% by weight of the composition.

18. A method for printing a three-dimensional part with an additive manufacturing system, the method comprising:
providing a support material in filament or powder form wherein the support material has a heat deflection temperature ranging from about 150° C. to less than about 220° C. and wherein the support material comprising a polyglycolic acid (PGA) polymer wherein the polyglycolic acid polymer comprises about 80% or more by weight of the composition, wherein at least a portion of the PGA polymer has monomer units with a structure:

and wherein the PGA polymer further comprises a chain extension bonded to the PGA polymer, wherein the extension comprises:
a linkage group bonded to the PGA polymer wherein the linkage group is selected from the group consisting of an epoxy group, an isocyanate group and an anhydride group prior to bonding with the PGA polymer, wherein the linkage group comprises about 0.1% by weight to about 5% by weight of the composition; and
a terminal group bonded to the linkage group, wherein the terminal group comprises a polymer chain wherein the terminal group comprises about 1% by weight to less than about 20% by weight of the composition wherein the polymer chain of the terminal group is derived from a thermoplastic material selected from the group consisting of polyethersulfone polysulfone, polyphenylsulfone, polycarbonate, polyamide, and mixtures thereof;

providing a part material;
printing layers of a support structure from the provided support material;
printing layers of the three-dimensional part from the provided part material in coordination with the printing of the layers of the support structure, wherein at least a portion the printed layers of the support structure support the printed layers of the three-dimensional part; and
dissolving at least a portion of the support structure from the three-dimensional part with an aqueous solution.

19. The method of claim 18 , wherein the support material has a heat deflection temperature ranging from about 160° C. to about 175° C.

20. The method of claim 18 , wherein the part material comprises a thermoplastic polymer selected from the group consisting of polyethersulfone polysulfone, polyphenylsulfone, polyetherimide, and mixtures ther

Assignees

• Stratasys Inc

Inventors

• Jaker Vittorio L
• Orrock James E
• Graley Christopher Scott

Classifications

• G03G15/225

  using contact-printing · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29B2009/125

  Micropellets, microgranules, microparticles · CPC title

• C08K3/04

  Carbon · CPC title

• B29C64/40

  Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title