Molding system having a residue cleaning feature and an adjustable mold shut height

US9713891B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9713891-B2
Application numberUS-201514945850-A
CountryUS
Kind codeB2
Filing dateNov 19, 2015
Priority dateAug 4, 2011
Publication dateJul 25, 2017
Grant dateJul 25, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method is provided of cleaning of a portion of a mold component, the portion of the mold component including a passage configured, in use, to allow passage of fluid and to prevent passage of melt, the method comprising: entering the mold component into a cleaning configuration, whereby a portion of the passage becomes part of a molding surface; performing a molding cycle to fill in at least the portion of the passage with molding material for incorporation and removal of a residue there from. Also provided is a mold having a first mold half and a second mold half, the halves being movable relative to each other. A mold shut height adjustment apparatus can provide for a change in the mold shut height.

First claim

Opening claim text (preview).

Therefore, what is to be protected by way of Letters Patent are limited only by the scope of the following claims: 1. A mold component configured to be actuated between: a first configuration in which the mold component comprises a passage along a split line that allows passage of fluid and prevents passage of the melt; and a second configuration in which the passage is actuated such as to become part of a molding surface, wherein in said second configuration, at least a portion of the passage can be flooded with the melt so that to incorporate and remove a residue therefrom and the melt front stops at a predefined point on the split line of the mold component, whereby melt flooding of the portion of the passage is executed in a controlled manner. 2. The mold component of claim 1 , wherein said passage comprises a portion that is susceptible to build-up of residue. 3. The mold component of claim 1 , wherein the predefined point is a thermal stop that is configured to control one or both of a temperature or rate of cooling fluid around the predefined point for the melt front stop to effectively freeze off the melt. 4. The mold component of claim 1 , further comprising: a primary vent area extending from the molding surface, the primary vent area is constructed and arranged to provide a variable size; and a secondary vent area in fluid communication with the primary vent area, at least a portion of the secondary vent area is constructed and arranged to provide a generally constant size; wherein, with reconfiguration of the mold component from a standard molding configuration to a vent cleaning configuration, a size of the primary vent area increases and a size of the portion of the secondary vent area remains generally constant such that molding material can flow into the primary vent area whereas molding material is substantially prevented from flowing into the secondary vent area. 5. The mold component of claim 4 , wherein the portion of the secondary vent area comprises an apex. 6. The mold component of claim 4 , wherein, when the mold component is in the standard molding configuration, the primary vent area and the portion of the secondary vent area are sized to provide a gap between about 0.03 mm and about 0.05 mm. 7. The mold component of claim 4 , wherein, when the mold component is in the vent cleaning configuration, the primary vent area is sized to provide a gap of about 0.28 mm and the portion of the secondary vent area remains sized to provide a gap between about 0.03 mm and about 0.05 mm. 8. The mold component of claim 4 , wherein the mold component comprises a first body portion and a second body portion, wherein each body portion comprises a first surface cooperating with each other to define the primary vent area, and wherein each body portion comprises a second surface cooperating with each other to define the portion of the secondary vent area. 9. The mold component of claim 8 , wherein the first component is a neck ring and second component is a lock ring, the neck ring having a first surface cooperating with a first surface of the lock ring to define the primary vent area, and the neck ring having a second surface cooperating with a second surface of the lock ring to define at least the portion of the secondary vent area.

Assignees

Inventors

Classifications

  • having transversely, e.g. radially, movable mould parts · CPC title

  • Cleaning or purging, e.g. of the injection unit (B29C45/24 takes precedence) · CPC title

  • Cleaning {(extruder parts B29C48/27; in general B08B7/00)} · CPC title

  • B29C45/34Primary

    having venting means · CPC title

  • of relative position of mould parts · CPC title

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Frequently asked questions

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What does patent US9713891B2 cover?
A method is provided of cleaning of a portion of a mold component, the portion of the mold component including a passage configured, in use, to allow passage of fluid and to prevent passage of melt, the method comprising: entering the mold component into a cleaning configuration, whereby a portion of the passage becomes part of a molding surface; performing a molding cycle to fill in at least t…
Who is the assignee on this patent?
Husky Injection Molding Systems Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/1753. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).