Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9713822-B2
Application number	US-201414535916-A
Country	US
Kind code	B2
Filing date	Nov 7, 2014
Priority date	Sep 28, 2011
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate holding rotating mechanism for holding and rotating a substrate;
a process liquid reservoir for reserving a processing liquid in an amount sufficient to form a liquid film covering the whole area of a principal face of the substrate, the process liquid reservoir being connected to one end of a process liquid discharge path;
a liquid film forming unit for forming a liquid film covering the whole area of the principal face of the substrate by supplying the process liquid reserved in the process liquid reservoir through the process liquid discharge path toward the principal face of the substrate held by the substrate holding rotating mechanism in a single burst;
a process liquid supply mechanism having a process liquid nozzle for dispensing a process liquid toward the principal face of the substrate held by the substrate holding rotating mechanism, the process liquid supply mechanism including a process liquid supply path which connects between a process liquid supply source for supplying the process liquid and the process liquid nozzle without going through the process liquid reservoir, the other end of the process liquid discharge path being connected to an intermediate portion of the process liquid supply path between the process liquid supply source and the process liquid nozzle; and
a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is supplied to the process liquid nozzle by going through the process liquid supply path and without going through the process liquid reservoir, so as to be dispensed from the process liquid nozzle toward the principal face of the substrate after the liquid film covering the whole area of the principal face of the substrate is formed by the liquid film forming unit which supplies the process liquid reserved in the process liquid reservoir though the process liquid discharge path, the process liquid supply path, and the process liquid nozzle, toward the principal face of the substrate.

2. The substrate processing apparatus according to claim 1 ,
wherein the control unit controls the substrate holding rotating mechanism so as to rotate the substrate at a first rotational speed when the liquid film covering the whole area of the principal face of the substrate is formed and rotate the substrate at a second rotational speed that is slower than the first rotational speed when the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after the liquid film covering the whole area of the principal face of the substrate is formed.

3. The substrate processing apparatus according to claim 1 ,
wherein the liquid film forming unit includes a pressurized gas supply mechanism that pushes out the process liquid reserved in the process liquid reservoir by pressurized gas.

4. The substrate processing apparatus according to claim 3 ,
wherein the pressurized gas supply mechanism includes a gas pipe connected with the process liquid reservoir and a pressurized gas valve interposed on the gas pipe,
the process liquid supply mechanism includes a process liquid valve interposed on the process liquid supply path, and
the process liquid discharge path is connected with the process liquid supply path at a position between the process liquid source and the process liquid valve and
further comprising a relief pipe and a relief valve interposed on the relief pipe.

5. The substrate processing apparatus according to claim 1 ,
wherein the process liquid reservoir includes a first process liquid reservoir for reserving a first process liquid and a second process liquid reservoir for reserving a second process liquid; and
the liquid film forming unit is configured such that the first process liquid is discharged in a single burst from the first process liquid reservoir, the second process liquid is discharged in a single burst from the second process liquid reservoir, and the first and second process liquids are supplied toward the principal face of the substrate while being mixed together.

6. The substrate processing apparatus according to claim 1 ,
further comprising a process liquid recovery mechanism that recovers a used process liquid which is supplied from the process liquid nozzle toward the substrate held by the substrate holding rotating mechanism and guides the used process liquid into the process liquid reservoir.

Assignees

• Screen Holdings Co Ltd

Inventors

• Miyagi Masahiro
• Hashimoto Koji
• Endo Toru

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H01L21/67051

  Electricity · mapped topic

• B05C11/1039

  Recovery of excess liquid or other fluent material; Controlling means therefor · CPC title

• B05C11/10

  Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material {(B05C1/0813, B05C5/0225, B05C17/002 and B05C19/06 take precedence)} · CPC title

• B05C13/00

  Means for manipulating or holding work, e.g. for separate articles {(B05C1/0821 takes precedence)} · CPC title