Deposition apparatus and deposition method using the same

Patent metadata

Field	Value
Publication number	US-9713818-B2
Application number	US-201514664672-A
Country	US
Kind code	B2
Filing date	Mar 20, 2015
Priority date	Oct 8, 2014
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A deposition apparatus and a deposition method are disclosed. In one aspect, the deposition apparatus includes an electrostatic chuck and a tensile plate attached to and formed over the electrostatic chuck. The deposition apparatus further includes an elevation unit configured to move the tensile plate towards the substrate and a tensile unit configured to apply a tensile force to the tensile plate to expand the tensile plate.

First claim

What is claimed is:

1. A deposition method comprising:
substantially aligning a mask with a substrate;
driving an elevation unit to lower a tensile plate in a direction towards the substrate such that an electrostatic chuck approaches the substrate;
applying a voltage to the electrostatic chuck to attach the substrate to the electrostatic chuck;
applying a tensile force via a tensile unit to the tensile plate so as to expand the tensile plate;
driving the elevation unit to lower the tensile plate such that the substrate adheres to the mask; and
depositing a deposition material from a source part onto the substrate through the mask,
wherein the tensile unit comprises a pressing part configured to press opposing edges of the tensile plate to substantially even flatten the tensile plate.

2. The deposition method of claim 1 , wherein the electrostatic chuck and the tensile plate have a shape corresponding to a downward curving shape of the substrate due to self-weight.

3. The deposition method of claim 1 , wherein the electrostatic chuck is formed as a thin film.

4. The deposition method of claim 1 , wherein the tensile plate is formed of a thin-film metal or polymer.

5. The deposition method of claim 1 , wherein the elevation unit comprises:
a first support part configured to support the tensile plate; and
a first driving unit formed on the first support part to provide a driving force configured to move the tensile plate.

6. The deposition method of claim 1 , wherein the tensile unit further comprises:
a second driving unit connected to the pressing part to provide a driving force to the pressing part.

7. The deposition method of claim 6 , further comprising a connection part configured to connect the elevation unit and the tensile unit,
wherein the elevation unit comprises:
a second support part configured to support the connection part; and
a third driving unit formed on the second support part to provide a driving force configured to move the connection part, and
wherein the pressing part and the second driving unit are formed on the connection part.

8. The deposition method of claim 1 , further comprising an elevatable magnet part, wherein the magnet part is formed on a surface which is opposite to a surface of the tensile plate to which the electrostatic chuck is attached such that the magnet part presses the tensile plate.

9. The deposition method of claim 8 , further comprising pressing the tensile plate by the magnet part from a surface which is opposite to a surface of the tensile plate to which the electrostatic chuck is attached, between the expanding of the tensile plate and the driving of the elevation unit to lower the tensile plate such that the substrate adheres to the mask.

Assignees

• Samsung Display Co Ltd

Inventors

• Han Jeongwon

Classifications

• B05B15/1222

  Operations & Transport · mapped topic

• B05B15/045

  Operations & Transport · mapped topic

• B05B5/087

  Arrangements of electrodes, e.g. of charging, shielding, collecting electrodes (B05B5/12, B05B5/14 take precedence; arrangements of electrodes on the discharge apparatus B05B5/0533) · CPC title

• B05B5/082

  characterised by means for supporting, holding or conveying the objects · CPC title

• B05B13/02 Primary

  Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work (B05B13/06 takes precedence) · CPC title