Conductive wire set
US-2024213699-A1 · Jun 27, 2024 · US
Terminal connection structure and semiconductor apparatus
US9711884B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9711884-B2 |
| Application number | US-201515123145-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 19, 2015 |
| Priority date | Mar 10, 2014 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A terminal connection structure includes a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides; wherein the male includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surface layer coated on the second primary coat, and the first primary coat and the second primary coat have different hardnesses.
First claim
Opening claim text (preview).
The invention claimed is: 1. A terminal connection structure, comprising: a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides, a hardness of the female terminal being different from that of the male terminal; wherein the male terminal includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surface layer coated on the second primary coat, the first primary coat and the second primary coat have different hardness, and the first primary coat is harder than the second primary coat. 2. The terminal connection structure of claim 1 , wherein the first primary coat is an electrodes NiP plating layer, and the second primary coat is a Ni electroplating layer. 3. A terminal connection structure, comprising: a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides; wherein the male terminal includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surface layer coated on the second primary coat, the first primary coat and the second primary coat have different hardness, and the second primary coat is an electrodes plating layer, and the first primary coat is an electroplating layer. 4. A semiconductor apparatus including the terminal connection structure of claim 1 , wherein the male terminal is a terminal for coupling a semiconductor module to an external device, and the female terminal is a terminal in a connector installed on a substrate.
Assignees
Inventors
Classifications
the semiconductor body being completely enclosed · CPC title
Multiple chips on leadframes · CPC title
Package configurations · CPC title
containing a filler · CPC title
forming a chip-scale package [CSP] · CPC title
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Frequently asked questions
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- What does patent US9711884B2 cover?
- A terminal connection structure includes a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides; wherein the male includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surfa…
- Who is the assignee on this patent?
- Nishihata Masayoshi, Toyota Motor Co Ltd, Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R13/113. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).