Methods and apparatus for post-chemical mechanical planarization substrate cleaning

Patent metadata

Field	Value
Publication number	US-9711381-B2
Application number	US-201414167818-A
Country	US
Kind code	B2
Filing date	Jan 29, 2014
Priority date	Jan 31, 2013
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.

First claim

The invention claimed is:

1. A particle cleaning module, comprising:
a housing;
a substrate holder disposed in the housing, the substrate holder configured to retain a substrate in a substantially vertical orientation, the substrate holder rotatable on a first axis;
a first pad holder disposed in the housing, the first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis;
a first actuator operable to move the first pad holder relative to the substrate holder to change a distance defined between the first pad holder and the substrate holder;
a first lateral actuator operable to move the first pad holder linearly across a major surface of the substrate holder through the first axis;
a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis; and
a second lateral actuator operable to move the second pad holder linearly across the major surface of the substrate holder in parallel with movement of the first pad holder and without intersecting the first axis.

2. The particle cleaning module of claim 1 , wherein the pad retaining surface of the second pad holder is positioned to contact an exclusion region and/or edge portion of a substrate.

3. The particle cleaning module of claim 1 , further comprising:
a second actuator operable to move the second pad holder relative to the substrate holder to change a distance defined between the second pad holder and the substrate holder.

4. The particle cleaning module of claim 1 , further comprising:
a substrate receiver disposed in the housing, the substrate receiver having a substrate receiving slot configured to accept a substrate.

5. The particle cleaning module of claim 4 , wherein the substrate receiver is operable to move between a first position that is aligned with a centerline of the substrate and a second position that is clear of the substrate.

6. The particle cleaning module of claim 1 , wherein the first pad holder has a diameter less than that of the substrate holder.

7. The particle cleaning module of claim 1 , wherein the second pad holder has a diameter less than that of the substrate holder.

8. The particle cleaning module of claim 1 , wherein the second pad holder has a diameter one eighth the diameter of the substrate holder.

9. The particle cleaning module of claim 1 , wherein the substrate holder is an electrostatic chuck or a vacuum chuck.

10. The particle cleaning module of claim 1 , further comprising:
a substrate rotation mechanism, operable to rotate the substrate holder about the first axis and coupled to the substrate holder by a first shaft.

11. The particle cleaning module of claim 1 , further comprising:
a plurality of spray bars disposed in the housing and configured to dispense a cleaning fluid in the housing.

12. The particle cleaning module of claim 1 , wherein the housing further comprises a lid configured to allow a robot access in and out of the housing.

13. The particle cleaning module of claim 1 , further comprising:
a pocket coupled to the housing and configured to receive the first pad holder.

Assignees

• Applied Materials Inc

Inventors

• Ko Sen-Hou
• Karuppiah Lakshmanan

Classifications

• H10P95/60

  Mechanical treatments, e.g. by ultrasounds · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title