Printed circuit for wireless power transfer

Patent metadata

Field	Value
Publication number	US-9711272-B2
Application number	US-201514795414-A
Country	US
Kind code	B2
Filing date	Jul 9, 2015
Priority date	Jul 9, 2015
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

Printed circuit includes a substrate body having a plurality of substrate layers stacked along a Z-axis. Each substrate layer is substantially planar and extends along an XY plane. The X-, Y-, and Z-axes are mutually perpendicular. The printed circuit also includes a Z-field coil that is coupled to the substrate body and has a conductive trace that is parallel to the XY plane. The printed circuit also includes an X-field coil having conductive trace segments that are coupled to the substrate body and parallel to the XY plane. The X-field coil includes conductive paths that extend substantially parallel to the Z-axis. The conductive paths interconnect the trace segments. The Z-field coil and the X-field coil are configured to generate respective vector components of a magnetic field or have a voltage induced therein by a magnetic field.

First claim

What is claimed is:

1. A printed circuit comprising:
a substrate body comprising a plurality of substrate layers stacked along a Z-axis, each substrate layer being substantially planar and extending along X- and Y-axes, wherein the X-, Y-, and Z-axes are mutually perpendicular;
a Z-field coil coupled to the substrate body and comprising a conductive trace that is parallel to an XY plane; and
an X-field coil comprising conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the X-field coil including conductive paths that extend substantially parallel to the Z-axis, the conductive paths interconnecting the trace segments to form the X-field coil;
wherein the Z-field coil and the X-field coil are configured to generate respective vector components of a magnetic field or have respective voltages induced therein by a magnetic field.

2. The printed circuit of claim 1 , further comprising a Y-field coil including conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the conductive trace segments of the Y-field coil being parallel to the Y-axis and the conductive trace segments of the X-field coil being parallel to the X-axis, the Y-field coil including conductive paths that extend substantially parallel to the Z-axis and interconnect the trace segments of the Y-field coil to form the Y-field coil, wherein the Y-field coil is configured to generate a respective vector component of the corresponding magnetic field or have a voltage induced therein by the corresponding magnetic field.

3. The printed circuit of claim 2 , wherein the Y-field coil includes a plurality of windings that wrap around a core region of the Y-field coil, the X-field coil being disposed within the core region.

4. The printed circuit of claim 1 , wherein at least one of the substrate layers comprises a ferromagnetic material.

5. The printed circuit of claim 4 , wherein the X-field coil has a plurality of windings that wrap around the ferromagnetic material.

6. The printed circuit of claim 4 , wherein the conductive paths of the X-field coil extend directly through the ferromagnetic material.

7. The printed circuit of claim 1 , wherein the X-field coil comprises first and second conductor arrays, each of the first and second conductor arrays including a plurality of the trace segments of the X-field coil, the trace segments of the first conductor array being coplanar and the trace segments of the second conductor array being coplanar, the first and second conductor arrays being separated by one or more of the substrate layers and being electrically coupled by the corresponding conductive paths of the X-field coil.

8. The printed circuit of claim 1 , wherein the Z-field coil includes a plurality of windings that wrap around one another in a spiral-like manner and are co-planar.

9. The printed circuit of claim 1 , wherein the Z-field coil is disposed along an outer surface of the printed circuit or disposed closer to the outer surface than the X-field coil.

10. The printed circuit of claim 1 , wherein one or more of the substrate layers are flexible layers.

11. A receiving device comprising:
a device housing;
a load coupled to the device housing and configured to receive electrical power;
a printed circuit coupled to the device housing and configured to provide the electrical power to the load, the printed circuit comprising:
a substrate body comprising a plurality of substrate layers stacked along a Z-axis, each substrate layer being substantially planar and extending along X- and Y-axes, wherein the X-, Y-, and Z-axes are mutually perpendicular;
a Z-field coil coupled to the substrate body and comprising a conductive trace that is parallel to an XY plane; and
an X-field coil comprising conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the X-field coil including conductive paths that extend substantially parallel to the Z-axis, the conductive paths interconnecting the trace segments to form the X-field coil;
wherein the Z-field coil and the X-field coil are configured to have voltages induced therein by a magnetic field for generating the electrical power.

12. The receiving device of claim 11 , further comprising a Y-field coil including conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the conductive trace segments of the Y-field coil being parallel to the Y-axis and the conductive trace segments of the X-field coil being parallel to the X-axis, the Y-field coil including conductive paths that extend substantially parallel to the Z-axis and interconnect the trace segments of the Y-field coil to form the Y-field coil, wherein the Y-field coil is configured to have a voltage induced therein by the magnetic field.

13. The receiving device of claim 12 , wherein the Y-field coil includes a plurality of windings that wrap around a core region of the Y-field coil, the X-field coil being disposed within the core region.

14. The receiving device of claim 11 , wherein at least one of the substrate layers comprises ferromagnetic material, the X-field coil having a plurality of windings that wrap around a core region of the X-field coil, wherein the ferromagnetic material is disposed within the core region of the X-field coil.

15. The receiving device of claim 11 , wherein the X-field coil comprises first and second conductor arrays, each of the first and second conductor arrays including a plurality of the trace segments of the X-field coil, the trace segments of the first conductor array being coplanar and the trace segments of the second conductor array being coplanar, the first and second conductor arrays being separated by one or more of the substrate layers and being electrically coupled by the corresponding conductive paths of the X-field coil.

16. The receiving device of claim 11 , further comprising control circuitry for communicating with a base station to communicate a charge status to the base station.

17. The receiving device of claim 11 , wherein one or more of the substrate layers are flexible layers.

18. A base station comprising:
a station housing having a charging surface;
a printed circuit positioned proximate to the charging surface, the printed circuit comprising:
a substrate body comprising a plurality of substrate layers stacked along a Z-axis, each substrate layer being substantially planar and extending along X- and Y-axes, wherein the X-, Y-, and Z-axes are mutually perpendicular;
a Z-field coil coupled to the substrate body and comprising a conductive trace that is parallel to an XY plane; and
an X-field coil comprising conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the X-field coil including conductive paths that extend substantially parallel to the Z-axis, the conductive paths interconnecting the trace segments to form the X-field coil;
wherein the Z-field coil and the X-field coil are configured to generate respective vector components of a magnetic field for generating electrical power in a receiving device.

19. The base station of claim 18 , further comprising a Y-field coil including conductive trace segments that are coupled to the substrate body and parallel to the XY plane, the conductive trace segments of the Y-field coil being parallel to the Y-axis and the conductive trace segments of the X-field coil being parallel to the X-axis, the Y-field coil including conductive paths that extend substantially parallel to the Z-axis and

Assignees

• Tyco Electronics Corp
• Te Connectivity Corp

Inventors

• Hassan-Ali Mudhafar
• Larson Jason

Classifications

• H02J50/005

  Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices · CPC title

• H02J7/35

  with light sensitive cells · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title