Chip electronic component and method of manufacturing the same
US-2015371752-A1 · Dec 24, 2015 · US
Electronic component
US9711270B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9711270-B2 |
| Application number | US-201615047141-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2016 |
| Priority date | Feb 25, 2015 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin. The soft magnetic metal powder has an average particle size of 12 μm or less. The magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component comprising: a laminate including a plurality of insulating layers stacked in a thickness direction and having a recess recessed in a stacking direction of the plurality of insulating layers, the recess being filled with a magnetic resin material; and at least one coil conductor provided in the laminate, wherein the magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin, the soft magnetic metal powder has an average particle size of 12 μm or less, the magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder, and the thermosetting resin is formed from an aromatic tetracarboxylic dianhydride and an aromatic diamine. 2. The electronic component according to claim 1 , wherein the soft magnetic metal powder is formed of a crystalline Fe—Ni alloy or a crystalline Fe—Si alloy, and the thermosetting resin is a polyimide resin formed from an aromatic tetracarboxylic dianhydride and an aromatic diamine. 3. The electronic component according to claim 1 , wherein the soft magnetic metal powder has a surface with an insulating coating. 4. An electronic component comprising: a laminate including a plurality of insulating layers stacked in a thickness direction and having a recess recessed in a stacking direction of the plurality of insulating layers, the recess being filled with a magnetic resin material; and at least one coil conductor provided in the laminate, wherein the magnetic resin material is formed of a magnetic powder-containing resin that is a mixture of a soft magnetic metal powder and a thermosetting resin, the soft magnetic metal powder has an average particle size of 12 μm or less, the magnetic powder-containing resin contains 65 vol % or more and 85 vol % or less of the soft magnetic metal powder, and an inner surface of the recess continuously curves while extending through the plurality of insulating layers in the stacking direction such that the recess has a parabolic shape protruding in a negative z-axis direction in side view. 5. The electronic component according to claim 4 , wherein the soft magnetic metal powder is formed of a crystalline Fe—Ni alloy or a crystalline Fe—Si alloy, and the thermosetting resin is formed from an aromatic tetracarboxylic dianhydride and an aromatic diamine. 6. The electronic component according to claim 4 , wherein the soft magnetic metal powder has a surface with an insulating coating.
Assignees
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Classifications
with stacked layers · CPC title
- H01F27/255Primary
made from particles (H01F27/26 takes precedence) · CPC title
with magnetic core · CPC title
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Frequently asked questions
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- What does patent US9711270B2 cover?
- A common mode choke coil as an electronic component includes a laminate. The laminate includes insulating layers stacked in a thickness direction and has a recess sinking in a stacking direction of the insulating layers. The laminate includes at least one coil conductor therein. The recess is filled with a magnetic resin material. The magnetic resin material is formed of a magnetic powder-conta…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H01F27/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).