Systems and methods for automated assembly of dynamic magnetic stripe communications devices

Patent metadata

Field	Value
Publication number	US-9710745-B1
Application number	US-201313762497-A
Country	US
Kind code	B1
Filing date	Feb 8, 2013
Priority date	Feb 9, 2012
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

An automated conveyor system extends a continuous layer of plastic onto a moving conveyor. A pair of damming strips may be applied to the continuous layer of plastic as the conveyor advances. A liquid material may be sprayed between the damming strips and electronic assemblies may be robotically picked and placed onto the continuous layer of plastic between the damming strips and on top of the liquid material. Additional liquid material may be sprayed on top of the electronic assemblies as the conveyor moves. A continuous top plastic layer may be extended on top of the electronic assemblies, while a roller compresses the electronic assemblies between the top plastic layer and bottom plastic layer. A transparent clamp holds a portion of the compressed sub-assembly in place while the sub-assembly is cured. A sheering station sheers the sub-assembly as the conveyor indexes.

First claim

What is claimed is:

1. A method comprising:
extending a portion of a first continuous sheet of plastic onto a moving conveyor;
robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;
applying a first material onto said electronic assembly;
extending a portion of a second continuous sheet of plastic over said electronic assembly;
curing at least a portion of said first material applied onto said electronic assembly;
applying a plurality of strips of damming material lengthwise, in parallel, on said portion of said first continuous sheet of plastic; and
applying a second material between at least two of said strips.

2. The method of claim 1 , further comprising:
moving, by said moving conveyor, said electronic assembly to a plurality of indexed positions.

3. The method of claim 1 , further comprising:
moving, by said moving conveyor, a plurality of electronic assemblies to a plurality of indexed positions.

4. The method of claim 1 , further comprising:
moving, by said moving conveyor, eight electronic assemblies to a plurality of indexed positions.

5. The method of claim 1 ,
wherein said applying a second material between at least two of said strips includes spraying a second liquid material between at least two of said strips.

6. The method of claim 1 ,
wherein said applying a second material between at least two of said strips includes spraying a second liquid material between at least two of said strips, and
wherein said applying a first material onto said electronic assembly includes spraying a first liquid material onto said electronic assembly.

7. The method of claim 1 , further comprising:
pressing, by a roller, said portion of said first continuous sheet of plastic, said electronic assembly, said first material applied onto said electronic assembly, and said portion of said second continuous sheet of plastic.

8. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic with a transparent clamp mechanism.

9. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic with a translucent clamp mechanism.

10. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly to create a compressed thickness of approximately 0.029 inches.

11. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly,
wherein said curing is performed during said clamping.

12. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly with a translucent clamping mechanism,
wherein said curing includes passing ultraviolet light through said clamping mechanism.

13. The method of claim 1 , further comprising:
clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly with a transparent clamping mechanism,
wherein said curing includes passing ultraviolet light through said clamping mechanism.

14. The method of claim 1 , further comprising:
peeling away a backing strip from one of the plurality of strips of damming material prior to said applying a plurality of strips of damming material.

15. A method comprising:
extending a portion of a first continuous sheet of plastic onto a moving conveyor;
robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;
applying a first material onto said electronic assembly;
extending a portion of a second continuous sheet of plastic over said electronic assembly;
curing at least a portion of said first material applied onto said electronic assembly;
applying a plurality of strips of damming material on said portion of said first continuous sheet of plastic; and
applying a second material between at least two of said strips,
wherein said robotically placing includes placing said electronic assembly between said at least two strips after said applying said second material between at least two of said strips.

16. The method of claim 15 ,
wherein said applying a second material between at least two of said strips includes applying a liquid material between at least two of said strips, and
wherein said robotically placing includes placing said electronic assembly on said liquid material.

17. The method of claim 15 ,
wherein said applying a second material between at least two of said strips includes applying a liquid material between at least two of said strips,
wherein said robotically placing includes placing said electronic assembly on said liquid material, and
wherein said applying a first material onto said electronic assembly occurs after said applying a liquid material between at least two strips and before said extending a portion of a second continuous sheet of plastic over said electronic assembly.

18. A method comprising:
extending a portion of a first continuous sheet of plastic onto a moving conveyor;
robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;
applying a material onto said electronic assembly;
extending a portion of a second continuous sheet of plastic over said electronic assembly;
curing at least a portion of said material; and
applying a plurality of strips of damming material lengthwise, in parallel, on said portion of said first continuous sheet of plastic.

19. The method of claim 18 , further comprising:
moving, by said moving conveyor, one or more electronic assemblies to one or more indexed positions.

20. The method of claim 18 , further comprising:
spraying a liquid material between at least two of said strips.

21. The method of claim 18 , further comprising:
spraying a first liquid material between at least two of said strips,
wherein said applying a material onto said electronic assembly includes spraying a second liquid material onto said electronic assembly.

22. The method of claim 18 , further comprising:
applying a second material between at least two of said strips,
wherein said robotically placing includes placing said electronic assembly between said at least two strips after said applying a second material between at least two of said strips.

23. The method of claim 18 , further comprising:
applying a liquid material between at least two of said strips,
wherein said robotically placing includes placing said electronic assembly on said liquid material.

24. The method of claim 18 , further comprising:
applying a liquid material between at least two of said strips,
wherein said robotically placing includes placing said electronic assembly on said liquid material, and
wherein said applying a material onto said electronic assembly occurs after said applying a liquid material between at least two strips and before said extending a portion of a second continuous sheet of plastic over said electronic assembly.

Assignees

• O'Shea Norman E
• Dynamics Inc

Inventors

• O'Shea Norman E

Classifications

• B32B38/0004

  Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence) · CPC title

• Y10T156/1097

  Lamina is running length web · CPC title

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• B32B37/1054 Primary

  Regulating the dimensions of the laminate, e.g. by adjusting the nip or platen gap · CPC title

• B32B37/226

  Laminating sheets, panels or inserts between two continuous plastic layers · CPC title