Micromechanical pressure sensor device and corresponding manufacturing method

Patent metadata

Field	Value
Publication number	US-9709451-B2
Application number	US-201514592610-A
Country	US
Kind code	B2
Filing date	Jan 8, 2015
Priority date	Jan 14, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A micromechanical pressure sensor device includes: an MEMS wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the MEMS wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers. A fixed second pressure detection electrode is formed spaced apart from and opposite the deflectable first pressure detection electrode. An elastically deflectable diaphragm area is formed above the front side of the MEMS wafer. An external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and the wafer is connected to the deflectable first pressure detection electrode via a plug-like joining area.

First claim

What is claimed is:

1. A micromechanical pressure sensor device, comprising:
an MEMS wafer having a front side and a rear side;
a first micromechanical functional layer formed above the front side of the MEMS wafer;
a second micromechanical functional layer formed above the first micromechanical functional layer;
a deflectable first pressure detection electrode formed in one of the first and second micromechanical functional layers;
a fixed second pressure detection electrode formed spaced apart from and opposite the deflectable first pressure detection electrode; and
an elastically deflectable diaphragm area formed above the front side of the MEMS wafer, wherein an external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, wherein the wafer is joined to the deflectable first pressure detection electrode via a plug-like joining area, and wherein the deflectable first pressure detection electrode is spatially separated from the elastically deflectable diaphragm in a vertical direction by a distance delimited by the plug-like joining area.

2. The micromechanical pressure sensor device as recited in claim 1 , wherein the plug-like joining area is formed centrally on the diaphragm area so that the first pressure detection electrode is deflectable essentially untilted.

3. The micromechanical pressure sensor device as recited in claim 2 , wherein the diaphragm area is formed in a third micromechanical functional layer, which is formed beneath the first micromechanical functional layer above the front side of the MEMS wafer.

4. The micromechanical pressure sensor device as recited in claim 2 , wherein the deflectable first pressure detection electrode is formed in the first micromechanical functional layer, and the fixed second pressure detection electrode is formed in the second micromechanical functional layer.

5. The micromechanical pressure sensor device as recited in claim 2 , wherein the deflectable first pressure detection electrode is formed in the second micromechanical functional layer, and the fixed second pressure detection electrode is formed in the first micromechanical functional layer.

6. The micromechanical pressure sensor device as recited in claim 2 , wherein the deflectable first pressure detection electrode is formed in the second micromechanical functional layer, and the fixed second pressure detection electrode is formed in a capping device which is bonded to the MEMS wafer.

7. A micromechanical pressure sensor device, comprising:
an MEMS wafer having a front side and a rear side;
a first micromechanical functional layer formed above the front side of the MEMS wafer;
a second micromechanical functional layer formed above the first micromechanical functional layer;
a deflectable first pressure detection electrode formed in one of the first and second micromechanical functional layers;
a fixed second pressure detection electrode formed spaced apart from and opposite the deflectable first pressure detection electrode; and
an elastically deflectable diaphragm area formed above the front side of the MEMS wafer, wherein an external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and wherein the wafer is joined to the deflectable first pressure detection electrode via a plug-like joining area,
wherein the plug-like joining area is formed decentrally on the diaphragm area, so that the first pressure detection electrode is deflectable in a tilted manner, and two fixed second pressure detection electrodes which are electrically insulated from each other are formed spaced apart from and opposite the deflectable first pressure detection electrode, and wherein the first pressure detection electrode is differently deflectable with respect to the two fixed second pressure detection electrodes.

8. The micromechanical pressure sensor device as recited in claim 1 , wherein the deflectable first pressure detection electrode is formed in the first micromechanical functional layer, the fixed second pressure detection electrode is formed in the second micromechanical functional layer, and a further fixed second pressure detection electrode is formed in a third micromechanical functional layer, which is formed beneath the first micromechanical functional layer above the front side of the MEMS wafer.

9. The micromechanical pressure sensor device as recited in claim 8 , wherein the deflectable first pressure detection electrode is electrically connected via a spring device which is formed in the first micromechanical functional layer.

10. The micromechanical pressure sensor device as recited in claim 9 , wherein a capping device is provided, which is bonded to the second micromechanical functional layer for enclosing a cavern at a predetermined enclosed pressure.

11. The micromechanical pressure sensor device as recited in claim 10 , wherein the capping device is an evaluation wafer.

12. The micromechanical pressure sensor device as recited in claim 8 , wherein the access opening is a through-hole in the MEMS wafer, through which the pressure is applied to the diaphragm area from the rear side.

13. The micromechanical pressure sensor device as recited in claim 8 , wherein the access opening is a lateral access opening on the front side of the MEMS wafer.

14. A method for manufacturing a micromechanical pressure sensor device, comprising:
providing an MEMS wafer having a front side and a rear side;
forming a first micromechanical functional layer above the front side of the MEMS wafer;
forming a second micromechanical functional layer above the first micromechanical functional layer;
forming a deflectable first pressure detection electrode in one of the first and second micromechanical functional layers;
forming a fixed second pressure detection electrode spaced apart from and opposite the deflectable first pressure detection electrode;
forming an elastically deflectable diaphragm area above the front side of the MEMS wafer, to which external pressure is applied via an access opening in the MEMS wafer; and
joining the elastically deflectable diaphragm area to the deflectable first pressure detection electrode via a plug-like joining area, wherein the deflectable first pressure detection electrode is spatially separated from the elastically deflectable diaphragm in a vertical direction by a distance delimited by the plug-like joining area.

Assignees

• Bosch Gmbh Robert

Inventors

• Kaelberer Arnd
• Reinmuth Jochen
• Classen Johannes

Classifications

• B81C1/00158

  Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039) · CPC title

• B81C1/00246

  Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate · CPC title

• G01P15/0802

  Details · CPC title

• G01L9/0072 Primary

  using variations in capacitance · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title