Structures for radiative cooling

Patent metadata

Field	Value
Publication number	US-9709349-B2
Application number	US-201313829997-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Nov 15, 2012
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

Various aspects as described herein are directed to a radiative cooling device and method for cooling an object. As consistent with one or more embodiments, a radiative cooling device includes a solar spectrum reflecting structure configured and arranged to suppress light modes, and a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions from the object and in mid-infrared (IR) wavelengths.

First claim

What is claimed is:

1. A radiative cooling device for cooling an object while the device is exposed to, or under sunlight, the device comprising:
a solar spectrum reflecting structure, including different materials at least one of which is layered or textured across with a dimension that is between 1 micron and 25 nanometers, the solar spectrum reflecting structure configured and arranged to suppress light modes, by inhibiting coupling of incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the device while the device is exposed to or under sunlight;
a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions, from the device while the device is exposed to or under sunlight, in mid- IR wavelengths;
at least a portion of each of the solar spectrum reflecting structure and the thermally-emissive structure being integrated as a constitution configured and arranged to both inhibit coupling of the incoming electromagnetic radiation to the device and facilitate the thermally-generated electromagnetic emissions, from the device that is exposed to or under sunlight, in mid-IR wavelengths; and
the said object thermally coupled to the device that is exposed to or under sunlight and configured to be cooled from the device that is exposed to or under sunlight and to a temperature that is below an ambient temperature.

2. The device of claim 1 , wherein the solar spectrum reflecting structure includes a multi-layer structure of alternating materials configured and arranged to suppress absorption of at least some wavelengths in the solar spectrum by the device, including radiation in wavelengths in at least one of visible spectrum, near IR, and ultraviolet spectrum.

3. The device of claim 1 , wherein the radiative cooling device is configured and arranged to provide radiative cooling below the ambient temperature and exceeding 20 W/m 2 at an ambient temperature while direct sunlight is striking the device.

4. The device of claim 1 , wherein the suppressed light modes inhibit coupling of incoming electromagnetic radiation of wavelengths from 300 nm to 4 μm.

5. The device of claim 1 , wherein the thermally-emissive structure is configured to facilitate thermally-generated emissions by coupling surface phonon-polaritons to free-space light modes.

6. The device of claim 1 , wherein the thermally-emissive structure is configured and arranged to facilitate thermally-generated emissions by exploiting near field coupling of light modes and sub-wavelength or wavelength-scale interference.

7. The device of claim 1 , wherein the constitution is less than 50 mm thick.

8. The device of claim 2 , wherein the multi-layer structure of alternating materials is configured and arranged to suppress the absorption in at least some wavelengths in the visible spectrum.

9. A method for cooling an object while being exposed to or under sunlight, the method comprising:
configuring the object to incorporate a solar spectrum reflecting structure to suppress light modes and by inhibiting coupling of incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object while being exposed to or under sunlight;
configuring the object to incorporate a thermally-emissive structure to facilitate thermally-generated electromagnetic emissions, from the object while being exposed to or under sunlight, in mid-IR wavelengths; and
wherein at least a portion of each of the solar spectrum reflecting structure and the thermally-emissive structure are integrated as a constitution to both inhibit the coupling of the incoming electromagnetic radiation to the object and facilitate the thermally-generated electromagnetic emissions, from the object while being exposed to or under sunlight, in mid-IR wavelengths, and providing radiative cooling below an ambient temperature.

10. The method of claim 9 , wherein using the solar spectrum reflecting structure further includes suppressing absorption of at least some wavelengths in the solar spectrum, including radiation in wavelengths in at least one of visible spectrum, near IR, and ultraviolet spectrum, by using a multi-layer structure of alternating materials, and wherein the object that is exposed to or under sunlight is used to cool another object that is thermally coupled to the object that is exposed to or under sunlight.

11. The method of claim 9 , further including a step of providing radiative cooling exceeding 20 W/m 2 at the ambient temperature while direct sunlight is striking the solar spectrum reflecting structure.

12. The method of claim 9 , wherein using the solar spectrum reflecting structure to suppress light modes further includes inhibiting coupling of incoming electromagnetic radiation of wavelengths from 300 nm to 4 μm.

13. The method of claim 9 , wherein using the thermally-emissive structure further includes facilitating thermally-generated emissions by coupling surface phonon-polaritons to free-space light modes.

14. The method of claim 9 , wherein using the thermally-emissive structure further includes facilitating thermally-generated emissions by exploiting near field coupling of light modes and sub-wavelength or wavelength-scale interference.

15. The device of claim 1 , wherein the solar spectrum reflecting structure includes a multi-layer structure of alternating materials having different dielectric constants.

16. The device of claim 1 , wherein the solar spectrum reflecting structure is further configured and arranged to both prohibit coupling of the incoming electromagnetic radiation to the device that is exposed to or under sunlight, and facilitate the thermally-generated electromagnetic emissions, from the device that is exposed to or under sunlight, in mid-IR wavelengths.

17. The device of claim 1 , wherein the constitution is configured and arranged with a multi-layer structure of alternating materials having different dielectric constants.

18. The device of claim 1 , wherein the constitution is configured and arranged to include at least one of: a multi-layer structure of alternating materials having different dielectric constants; a grating layer configured and arranged to couple surface phonon-polaritons to free-space light modes; and a photonic crystal configured and arranged to couple surface phonon-polaritons to free-space light modes.

19. The device of claim 1 , wherein the constitution is configured and arranged to include a grating layer configured and arranged to couple surface phonon-polaritons to free-space light modes.

20. The device of claim 1 , wherein the constitution is configured and arranged to include a photonic crystal configured and arranged to couple surface phonon-polaritons to free-space light modes.

21. The device of claim 1 , wherein the constitution is configured and arranged to suppress the absorption of solar light throughout the solar spectrum.

22. The device of claim 1 , wherein the solar spectrum reflecting structure includes a multi-layer structure of alternating materials.

Assignees

• Univ Leland Stanford Junior

Inventors

• Raman Aaswath Pattabhi
• Fan Shanhui
• Rephaeli Eden

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• B82Y20/00

  Nanooptics, e.g. quantum optics or photonic crystals · CPC title

• F28F2013/008

  Variable conductance materials; Thermal switches · CPC title

• H01L23/473

  Electricity · mapped topic