Method for maintenance of used permanent cathode plates

US9708725B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9708725-B2
Application numberUS-201415104312-A
CountryUS
Kind codeB2
Filing dateDec 16, 2014
Priority dateDec 18, 2013
Publication dateJul 18, 2017
Grant dateJul 18, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for maintenance of used permanent cathode plates, said used cathode plate having scratches, crud formations and oversize grain boundaries on a surface of the cathode plate. The method comprises removing of scratches and accumulated crud from the surface of the cathode plate. The method further comprises removing substantially completely the oversize grain boundaries from the surface, and thereafter regenerating the grain boundaries of the surface of the cathode plate to an average grain boundary width of 1 to 3 μm and an average grain boundary depth less than 1 μm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for maintenance of used permanent cathode plates made of stainless steel, said used cathode plate having scratches, crud formations and oversize grain boundaries on a surface of the cathode plate, the method comprising: removing of scratches and accumulated crud from the surface of the cathode plate, removing substantially completely the oversize grain boundaries from the surface, and thereafter regenerating the grain boundaries of the surface of the cathode plate to an average grain boundary width of 1 to 3 μm and an average grain boundary depth less than 1 μm. 2. The method according to claim 1 , further comprising alkaline treatment of the surface of the cathode plate for removing the accumulated crud before removing the oversize grain boundaries from the surface of the cathode plate. 3. The method according to claim 1 , further comprising mechanical grinding of the surface of the cathode plate for removing the accumulated crud. 4. The method according to claim 1 , further comprising mechanical grinding of the surface of the cathode plate for removing the oversize grain boundaries. 5. The method according to claim 1 , further comprising mechanical grinding of the surface of the cathode plate wherein the mechanical grinding is performed in two phases comprising a first phase grinding to surface roughness Ra of about 0.9-1.1 μm and thereafter a second phase grinding to surface roughness Ra of about 0.2-0.4 μm. 6. The method according to claim 5 , wherein the mechanical grinding is implemented by at least one of belt grinding and circular grinding. 7. The method according to claim 2 , wherein, the alkaline treatment of the surface comprises subjecting the surface to liquid caustic soda (NaOH) having a pH greater than at least one of 10 and a pH of potassium hydroxide (KOH). 8. The method according to claim 7 , wherein the alkaline treatment of the surface comprises subjecting the surface to 10M liquid caustic soda (NaOH) at a temperature of 50° C. 9. The method according to claim 1 , wherein regenerating of the grain boundaries of the surface of the cathode plate is performed by at least one of the chemically and electrochemically. 10. The method according to claim 1 , wherein the electrochemical regenerating of the grain boundaries comprises etching the plate surface with nitric acid 60% solution (HNO 3 ) using a current of 15-40 As/cm 2 , and preferably 20 As/cm 2 . 11. The method according to claim 1 , wherein the chemical regenerating of the grain boundaries comprises subjecting the plate surface to at least one of oxalic acid (H 2 C 2 O 4 ) and sulphuric acid (H 2 SO 4 ) and sulphuric acid-based copper electrolyte. 12. The method according to claim 1 , wherein the electrochemical regenerating of the grain boundaries comprises subjecting the plate surface to sulphuric acid-based electrolyte obtained from electrolysis. 13. The method according to claim 1 , wherein the electrochemical regenerating of the grain boundaries comprises etching the plate surface with sulphuric acid-based electrolyte using current 10-40 As/cm 2 , preferably 20 As/cm 2 . 14. The method according to claim 1 , further comprising passivation of the surface after regeneration of the grain boundaries. 15. The method according to claim 14 , wherein the passivation of the surface comprises dipping the cathode plate into nitric acid (HNO 3 ) or citric acid (C 6 H 8 O 7 ). 16. The method according to claim 15 , further comprising neutralizing and washing of the surface to neutralize and wash out the nitric acid or citric acid after passivation.

Assignees

Inventors

Classifications

  • Operating or servicing · CPC title

  • C25C7/02Primary

    Electrodes (consumable anodes for the refining the metals C25C1/00 - C25C5/00); Connections thereof · CPC title

  • C25F3/06Primary

    of iron or steel · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9708725B2 cover?
A method for maintenance of used permanent cathode plates, said used cathode plate having scratches, crud formations and oversize grain boundaries on a surface of the cathode plate. The method comprises removing of scratches and accumulated crud from the surface of the cathode plate. The method further comprises removing substantially completely the oversize grain boundaries from the surface, a…
Who is the assignee on this patent?
Outotec Finland Oy
What technology area does this patent fall under?
Primary CPC classification C25C7/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).