Nonwoven laminate
US-12152326-B1 · Nov 26, 2024 · US
US9708513B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9708513-B2 |
| Application number | US-201314399228-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 6, 2013 |
| Priority date | May 7, 2012 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to a sealing device ( 1 ) which comprises a barrier layer ( 2 ) with a thermoplastic polymer P1, and an adhesive layer ( 3 ) with at least one ethylene-vinyl acetate copolymer (EVA) P2 and azo-dicarbonamide A, and which is suitable for sealing bases in the building sector. The invention further relates to a method for sealing said bases. The method according to the invention allows structures of civil engineering to be sealed rapidly and efficiently and ensures good adhesion of the sealing device on the base.
Opening claim text (preview).
The invention claimed is: 1. A sealing device comprising: a sealing layer comprising a thermoplastic polymer; and an adhesive layer comprising: at least one ethylene-vinyl acetate copolymer; and an azodicarbonamide; wherein the adhesive layer comprises from 0 to 0.5 wt. % of an epoxy resin, based on the total weight of the adhesive layer. 2. The sealing device according to claim 1 , wherein the ethylene-vinyl acetate copolymer comprises from about 25 wt. % to about 30 wt. % vinyl acetate. 3. The sealing device of claim 1 , wherein the azodicarbonamide is present from about 0.5 wt. % to about 2 wt. %, based upon a total weight of the ethylene-vinyl acetate copolymer and the azodicarbonamide. 4. The sealing device of claim 1 , wherein the azodicarbonamide is present from about 4 wt. % to about 8 wt. % based upon a total weight of the ethylene-vinyl acetate copolymer and the azodicarbonamide. 5. The sealing device of claim 1 , wherein the ethylene-vinyl acetate copolymer comprises about 7 wt. % to about 30 wt. % vinyl acetate. 6. The sealing device of claim 1 , wherein the azodicarbonamide is present from about 0.1 wt. % to about 15 wt. % based upon a total weight of the ethylene-vinyl acetate copolymer and the azodicarbonamide. 7. The sealing device of claim 1 , wherein the azodicarbonamide is present from about 2 wt. % to about 10 wt. % based upon a total weight of the ethylene-vinyl acetate copolymer and the azodicarbonamide. 8. The sealing of claim 1 , wherein the adhesive layer further comprises a polymer selected from the group consisting of a maleic acid anhydride-functionalized polyethylene and a maleic acid anhydride-functionalized copolymer made of ethylene and vinyl acetate. 9. The sealing device of claim 8 , wherein the polymer is present from about 4 wt. % to about 17 wt. %, and the azodicarbonamide is present from about 2 wt. % to about 6 wt. % based upon a total weight of ethylene-vinyl acetate copolymer, polymer, and azodicarbonamide. 10. The sealing of claim 8 , wherein the polymer is a maleic acid anhydride-functionalized polyethylene that comprises maleic acid anhydride-functionalized low density polyethylene or maleic acid anhydride-functionalized high density polyethylene. 11. The sealing of claim 8 , wherein the polymer is a maleic acid anhydride-functionalized copolymer comprising ethylene and vinyl acetate. 12. The sealing device of claim 1 , wherein the adhesive layer is free of epoxy resin. 13. The sealing device of claim 1 , wherein the sealing layer comprises a foamed portion on a side facing the adhesive layer. 14. The sealing device of claim 1 , wherein the adhesive layer is tack-free at 23° C. 15. A method for sealing a substrate, the method comprising: applying the sealing device of claim 1 to the substrate, wherein the adhesive layer faces the substrate; and heating the adhesive layer. 16. The method of claim 15 , wherein the heating comprises heating to a temperature of about 80° C. to about 600° C. 17. The method of claim 15 further comprising applying a second substrate to the sealing layer after heating the adhesive layer. 18. The method according to claim 17 , wherein the second substrate is asphalt.
Polymer of monoethylenically unsaturated hydrocarbon · CPC title
Polyolefin · CPC title
Chemistry & Metallurgy · mapped topic
Synthetic resin · CPC title
characterised by features of a layer {of} foamed material · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.