Powder for 3D modeling, set for 3D modeling, method of manufacturing 3D object, and device for manufacturing 3D object

US9708502B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9708502-B2
Application numberUS-201514956916-A
CountryUS
Kind codeB2
Filing dateDec 2, 2015
Priority dateDec 18, 2014
Publication dateJul 18, 2017
Grant dateJul 18, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A powder for 3D modeling includes a base particle and a resin having a functional group represented by the following Chemical formula 1, where A 1 represents O or NH and R 1 , R 2 , and R 3 each, independently represent CH 3 , C 2 H 5 , C 3 H 7 , or C 4 H 9 . The base particle is covered with the resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A powder for 3D modeling comprising: a base particle; and a resin having a functional group represented by the following Chemical formula 1, where A 1 represents O or NH and R 1 , R 2 , and R 3 each, independently represent CH 3 , C 2 H 5 , C 3 H 7 , or C 4 H 9 , wherein the base particle is covered with the resin. 2. The powder according to claim 1 , wherein the resin comprises a water soluble resin. 3. The powder according to claim 1 , wherein the resin comprises polyvinyl alcohol. 4. The powder according to claim 1 , wherein the resin comprises diacetone acrylamide-modified polyvinyl alcohol. 5. The powder according to claim 1 , wherein the resin has an average polymerization degree of from 500 to 1,700. 6. A set for 3D modeling comprising: a powder comprising a base particle and a resin having a functional group represented by the following Chemical formula 1, where A 1 represents O or NH and R 1 , R 2 , and R 3 each, independently represent CH 3 , C 2 H 5 , C 3 H 7 , or C 4 H 9 ; and a solution comprising a solvent that dissolves the resin, wherein the base particle is covered with the resin. 7. The set for 3D modeling according to claim 6 , wherein the solution comprises a compound that conducts cross-linking reaction with the functional group represented by the Chemical formula 1. 8. The set for 3D modeling according to claim 6 , wherein the resin comprises a water soluble resin and the solvent comprises water. 9. A method of manufacturing a 3D object comprising: forming a powder layer for 3D modeling on a substrate using the powder of claim 1 ; curing an area of the powder layer for 3D modeling by imparting a solution containing a solvent that dissolves the resin to the area; and repeating the step of the forming and the step of curing. 10. The method of manufacturing a 3D object according to claim 9 , wherein the step of imparting is conducted by an inkjet discharging method. 11. A device for manufacturing a 3D object comprising: a powder layer forming device to form a layer of the powder for 3D modeling of claim 1 on a substrate; and a solution imparting device to impart a solution comprising a solvent that dissolves the resin to cure an area of the layer.

Assignees

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Classifications

  • Rollers · CPC title

  • Nozzles · CPC title

  • by embedding the binder within the powder bed · CPC title

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials · CPC title

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Frequently asked questions

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What does patent US9708502B2 cover?
A powder for 3D modeling includes a base particle and a resin having a functional group represented by the following Chemical formula 1, where A 1 represents O or NH and R 1 , R 2 , and R 3 each, independently represent CH 3 , C 2 H 5 , C 3 H 7 , or C 4 H 9 . The base particle is covered with the resin.
Who is the assignee on this patent?
Naruse Mitsuru, Tamoto Nozomu, Suzuki Yasuo, and 4 more
What technology area does this patent fall under?
Primary CPC classification C09D129/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).