Composite material and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9707737-B2
Application number	US-201514885527-A
Country	US
Kind code	B2
Filing date	Oct 16, 2015
Priority date	Dec 15, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A composite material includes: a heat dissipation sheet; a heat insulation material that is placed on one surface of the heat dissipation sheet; and a support layer that is placed on at least one of the other surface of the heat dissipation sheet and the other surface of the heat insulation material, wherein silica aerogel is included between fibers in an inner region of the heat insulation material, an outer peripheral region of the heat insulation material includes the fibers, and the heat dissipation sheet and the heat insulation material are fixed onto each other through the fibers. Furthermore, provided is an electronic apparatus, including a heat generating component; and the above composite material, wherein the composite material is placed between the housing and the heat generating component.

First claim

What is claimed is:

1. A composite material, comprising:
a heat dissipation sheet;
a surface of a heat insulation material on one surface of the heat dissipation sheet; and
support layers on the other surface of the heat dissipation sheet and the other surface of the heat insulation material, wherein
silica aerogel is included between fibers in an inner region of the heat insulation material,
an outer peripheral region of the heat insulation material includes the fibers,
the heat dissipation sheet and the heat insulation material are fixed onto each other through the fibers, and
the support layers are insulating films.

2. The composite material according to claim 1 , wherein the heat insulation material has an area larger than that of the heat dissipation sheet, the inner region has the same area as that of the heat dissipation sheet, and the fibers in the outer peripheral portion and the support layer are fixed onto each other through fusion bonding.

3. The composite material according to claim 1 , wherein the silica aerogel is not present in the outer peripheral region of the heat insulation material.

4. The composite material according to claim 1 , wherein a bonding material is not present between the heat dissipation sheet and the heat insulation material.

5. The composite material according to claim 1 , wherein the fibers are in the inner region and the outer peripheral region of the heat insulation material.

6. The composite material according to claim 1 , wherein the support layers are each fixed onto the fibers in the outer peripheral region through fusion bonding.

7. The composite material according to claim 6 , wherein the fusion bonding is placed on an entire circumference of the heat insulation material.

8. An electronic apparatus, comprising:
a housing;
a heat generating component; and
the composite material according to claim 1 , wherein
the composite material is placed between the housing and the heat generating component.

9. The composite material according to claim 1 , wherein a material of the support layer is the same material as that of the fiber.

10. The composite material according to claim 1 , wherein each of the inner region and the outer peripheral region is one.

11. A composite material, comprising:
a heat dissipation sheet;
a surface of a heat insulation material on one surface of the heat dissipation sheet; and
support layers on the other surface of the heat dissipation sheet and the other surface of the heat insulation material, wherein
silica aerogel is included between fibers in an inner region of the heat insulation material,
an outer peripheral region of the heat insulation material includes the fibers,
the heat dissipation sheet and the heat insulation material are fixed onto each other through the fibers, and
wherein the heat dissipation sheet is a graphite sheet, the graphite sheet has a thickness of 100 μm or less, a heat conductivity in the planar direction of 1000 W/m·K or more, and a heat conductivity in the thickness direction of 20 W/m·K or less, and the heat insulation material has a thickness within a range of 0.05 mm to 1 mm, and a heat conductivity within a range of 0.01 to 0.1 W/m·K.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nakamura Taichi
• Sakatani Shigeaki

Classifications

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• B32B27/06

  as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title

• B32B9/007 Primary

  comprising carbon, e.g. graphite, composite carbon · CPC title

• B32B2307/302

  Conductive · CPC title

• B32B2457/00

  Electrical equipment · CPC title