Chemical mechanical polishing method
US-2015375361-A1 · Dec 31, 2015 · US
US9707663B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9707663-B2 |
| Application number | US-201214001791-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2012 |
| Priority date | Feb 28, 2011 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
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A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and laminating the polishing pad base with a porous polyurethane layer containing wet-solidified polyurethane as primary component which has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface to serve as polishing surface layer.
Opening claim text (preview).
The invention claimed is: 1. A polishing pad comprising a laminate including a polishing pad base and a porous polyurethane layer, the polishing pad base comprising a nonwoven fabric impregnated with a polyurethane based elastomer, the nonwoven fabric being formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less and the polyurethane based elastomer being present in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and the porous polyurethane layer containing polyurethane as a primary component, wherein the porous polyurethane layer has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface and the compression elastic modulus is 0.17 MPa or more and 0.32 MPa or less. 2. A polishing pad as described in claim 1 wherein the ultrafine fiber's average monofilament diameter is 3.5 μm or more and 6.0 μm or less. 3. A polishing pad as described in either claim 1 or 2 wherein the polyurethane based elastomer accounts for 20 mass % or more and 30 mass % or less relative to the polishing pad base. 4. A polishing pad as described in claim 1 wherein the nonwoven fabric contains a nitrile butadiene based elastomer. 5. A polishing pad as described in claim 1 wherein the coefficient of variation of the average monofilament diameter of the ultrafine fibers in the nonwoven fabric is 10% or less.
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
with polyurethanes · CPC title
Coagulated materials · CPC title
using ultra-fine two-component fibres, e.g. island/sea, or ultra-fine one component fibres (< 1 denier) · CPC title
characterised by the composition or properties of the pad materials · CPC title
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