Polishing pad

US9707663B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9707663-B2
Application numberUS-201214001791-A
CountryUS
Kind codeB2
Filing dateJan 30, 2012
Priority dateFeb 28, 2011
Publication dateJul 18, 2017
Grant dateJul 18, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and laminating the polishing pad base with a porous polyurethane layer containing wet-solidified polyurethane as primary component which has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface to serve as polishing surface layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing pad comprising a laminate including a polishing pad base and a porous polyurethane layer, the polishing pad base comprising a nonwoven fabric impregnated with a polyurethane based elastomer, the nonwoven fabric being formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less and the polyurethane based elastomer being present in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and the porous polyurethane layer containing polyurethane as a primary component, wherein the porous polyurethane layer has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface and the compression elastic modulus is 0.17 MPa or more and 0.32 MPa or less. 2. A polishing pad as described in claim 1 wherein the ultrafine fiber's average monofilament diameter is 3.5 μm or more and 6.0 μm or less. 3. A polishing pad as described in either claim 1 or 2 wherein the polyurethane based elastomer accounts for 20 mass % or more and 30 mass % or less relative to the polishing pad base. 4. A polishing pad as described in claim 1 wherein the nonwoven fabric contains a nitrile butadiene based elastomer. 5. A polishing pad as described in claim 1 wherein the coefficient of variation of the average monofilament diameter of the ultrafine fibers in the nonwoven fabric is 10% or less.

Assignees

Inventors

Classifications

  • Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

  • with polyurethanes · CPC title

  • Coagulated materials · CPC title

  • using ultra-fine two-component fibres, e.g. island/sea, or ultra-fine one component fibres (< 1 denier) · CPC title

  • B24B37/24Primary

    characterised by the composition or properties of the pad materials · CPC title

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What does patent US9707663B2 cover?
A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more an…
Who is the assignee on this patent?
Shiro Kuniyasu, Wada Masaharu, Kato Hiroyasu, and 5 more
What technology area does this patent fall under?
Primary CPC classification B24B37/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).