System and method for an acoustic transducer and environmental sensor package

Patent metadata

Field	Value
Publication number	US-9706294-B2
Application number	US-201514661429-A
Country	US
Kind code	B2
Filing date	Mar 18, 2015
Priority date	Mar 18, 2015
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.

First claim

What is claimed is:

1. A transducer package comprising:
a circuit board comprising a port;
a lid disposed over the port, wherein the lid encloses a first region;
an acoustic transducer disposed over the port and comprising a membrane, wherein the membrane separates the port from the first region;
an environmental transducer disposed at the circuit board in the port;
a housing structure coupled to the circuit board, wherein the port is fluidically coupled with an ambient environment through an opening in the housing structure; and
a protective structure arranged in the opening in the housing structure between the port and the ambient environment.

2. The transducer package of claim 1 , wherein the environmental transducer is disposed on a top side of the circuit board in a cavity of the acoustic transducer.

3. The transducer package of claim 1 , wherein the environmental transducer is disposed in the circuit board.

4. The transducer package of claim 1 , wherein the protective structure comprises a mesh, wherein the mesh is water impermeable.

5. The transducer package of claim 1 , further comprising an integrated circuit disposed on the circuit board and coupled to the acoustic transducer and the environmental transducer.

6. The transducer package of claim 5 , wherein the integrated circuit comprises:
shared circuit blocks coupled to both the acoustic transducer and the environmental transducer; and
dedicated circuit blocks coupled only to the acoustic transducer.

7. The transducer package of claim 1 , wherein the environmental transducer comprises a plurality of environmental transducers.

8. The transducer package of claim 1 , wherein the environmental transducer comprises a sensor selected from a group comprising a humidity sensor, a pressure sensor, a temperature sensor, and a gas sensor.

9. A transducer package comprising:
a circuit board;
a lid disposed on the circuit board;
a port formed in the circuit board or the lid;
an acoustic transducer disposed on the circuit board and comprising a membrane, wherein the membrane is in fluid communication with an ambient environment through the port; and
an integrated circuit die disposed on the circuit board, wherein the integrated circuit die comprises:
an environmental transducer formed in the integrated circuit die, wherein the environmental transducer is in fluid communication with the ambient environment through the port,
a shared interface circuit coupled to the environmental transducer and the acoustic transducer, and
an acoustic circuit coupled to only the acoustic transducer.

10. The transducer package of claim 9 , wherein the environmental transducer comprises a pressure sensor.

11. The transducer package of claim 10 , wherein the environmental transducer further comprises a temperature sensor, a humidity sensor, or a gas sensor.

12. The transducer package of claim 9 , further comprising a protective structure arranged between the port and the ambient environment.

13. The transducer package of claim 12 , wherein the protective structure comprises a mesh, wherein the mesh is water impermeable.

14. A transducer package, comprising:
a circuit board comprising a port;
a lid disposed over the port, wherein the lid encloses a first region;
an acoustic transducer disposed over the port and comprising a membrane, wherein the membrane separates the port from the first region; and
an acoustic bypass valve, different from the membrane, disposed within the circuit board, the acoustic bypass valve coupling the port and the first region, the acoustic bypass valve being configured to equalize a pressure across the membrane of the acoustic transducer.

15. The transducer package of claim 14 , further comprising an environmental transducer disposed within the first region, the environmental transducer being configured to receive an environmental signal through the acoustic bypass valve.

16. The transducer package of claim 15 , wherein the environmental transducer comprises a sensor selected from a group comprising a humidity sensor, a pressure sensor, a temperature sensor, and a gas sensor.

17. The transducer package of claim 14 , further comprising a housing structure coupled to the circuit board, wherein the port is fluidically coupled with an ambient environment through an opening in the housing structure.

18. The transducer package of claim 17 , further comprising a protective structure arranged in the opening in the housing structure between the port and the ambient environment.

19. The transducer package of claim 18 , wherein the protective structure comprises a mesh.

20. The transducer package of claim 19 , wherein the mesh is water impermeable.

Assignees

• Infineon Technologies Ag

Inventors

• Kopetz Andreas
• Wiesbauer Andreas
• Helm Roland
• Mandl Christian
• Walther Arnaud

Classifications

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title

• H04R3/00 Primary

  Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• G01N27/04

  by investigating resistance · CPC title