Power conversion device

Patent metadata

Field	Value
Publication number	US-9705407-B2
Application number	US-201615057466-A
Country	US
Kind code	B2
Filing date	Mar 1, 2016
Priority date	Jul 15, 2015
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A power conversion device including: a chassis in which a heat sink is housed, and within which an upper space above the heat sink, a lower space below the heat sink, and a vertically continuous space that continues from a lower part to an upper part of the chassis are formed; a first substrate arranged from the lower space to the vertically continuous space, in which heat of a component mounted on the first substrate is transferred to the heat sink; a second substrate arranged in the upper space, in which heat of a component mounted on the second substrate is transferred to the heat sink; a wiring connecting the first substrate to the second substrate and passing through the vertically continuous space; and a tall electronic component taller than heights of the upper and lower spaces, that is mounted on the first substrate and arranged in the vertically continuous space.

First claim

The invention claimed is:

1. A power conversion device comprising:
a heat sink;
a chassis in which the heat sink is housed;
an upper space above the heat sink, the upper space being formed within the chassis;
a lower space below the heat sink, the lower space being formed within the chassis;
a vertically continuous space that continues from a lower part of the chassis to an upper part of the chassis, the vertically continuous space being formed within the chassis, the heat sink being arranged outside of the vertically continuous space;
a first substrate arranged from the lower space to the vertically continuous space, in which heat of a first heat-generating electronic component mounted on the first substrate is transferred to the heat sink;
a second substrate arranged in the upper space, in which heat of a second heat-generating electronic component mounted on the second substrate is transferred to the heat sink;
a wiring configured to electrically connect the first substrate to the second substrate, the wiring being arranged to pass through the vertically continuous space; and
an electronic component taller than each of a height of the upper space and a height of the lower space, the electronic component being mounted on the first substrate in a state of being arranged in the vertically continuous space.

2. The power conversion device according to claim 1 , wherein the first heat-generating electronic component includes a first element body that is fixed on a cooling lower surface of the heat sink in a surface contact state, and a first lead terminal that extends downward from the first element body and is connected to the first substrate.

3. The power conversion device according to claim 2 , wherein the cooling lower surface of the heat sink is formed to be closer to the first substrate than another lower surface of the heat sink, the another lower surface being not in contact with the first element body.

4. The power conversion device according to claim 1 , wherein the second heat-generating electronic component includes a second element body that is fixed on a cooling upper surface of the heat sink in a surface contact state, and a second lead terminal that extends upward from the second element body and is connected to the second substrate.

5. The power conversion device according to claim 4 , wherein the cooling upper surface of the heat sink is formed to be closer to the second substrate than another upper surface of the heat sink, the another upper surface being not in contact which the second element body.

6. The power conversion device according to claim 2 , wherein the second heat-generating electronic component includes a second element body that is fixed on a cooling upper surface of the heat sink in a surface contact state, and a second lead terminal that extends upward from the second element body and is connected to the second substrate.

7. The power conversion device according to claim 6 , wherein the cooling upper surface of the heat sink is formed to be closer to the second substrate than another upper surface of the heat sink, the another upper surface being not in contact which the second element body.

8. The power conversion device according to claim 3 , wherein the second heat-generating electronic component includes a second element body that is fixed on a cooling upper surface of the heat sink in a surface contact state, and a second lead terminal that extends upward from the second element body and is connected to the second substrate.

9. The power conversion device according to claim 8 , wherein the cooling upper surface of the heat sink is formed to be closer to the second substrate than another upper surface of the heat sink, the another upper surface being not in contact which the second element body.

Assignees

• Fuji Electric Co Ltd

Inventors

• Gekinozu Masakazu
• Fukuchi Shun

Classifications

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H02M7/219

  in a bridge configuration · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H02M7/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title