Light-emitting device and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9705048-B2
Application number	US-201013501065-A
Country	US
Kind code	B2
Filing date	Oct 8, 2010
Priority date	Oct 15, 2009
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A light-emitting device includes a light emitting element, a resin package defining a recessed portion serving as a mounting region of the light emitting element, gate marks each formed on an outer side surface of the resin package, and leads disposed on the bottom surface of the recessed portion and electrically connected to the light emitting element. The light emitting element is mounted on the lead. The gate marks include a first gate mark formed on a first outer side surface of the resin package and a second gate mark formed on an outer side surface which is different than the first outer side surface.

First claim

The invention claimed is:

1. A light emitting device comprising:
a light emitting element;
a resin package defining a recessed portion serving as a mounting region of the light emitting element, the resin package being formed of a resin package material;
a gate mark formed on an outer side surface of the resin package, the gate mark being one of a projection projecting out from the outer side surface or a recess depressed inwardly from the outer side surface;
a lead arranged on a bottom surface of the recessed portion and electrically connected with the light emitting element, the light emitting element being mounted on the lead; and
a sealing member disposed in the recessed portion of the resin package and covering the light emitting element,
wherein the gate mark includes a first gate mark that is made only of the resin package material and is formed on a first outer side surface of the resin package, and a second gate mark that is made only of the resin package material and is formed on an outer side surface of the resin package which is a different outer side surface than the first outer side surface, the first gate mark and the second gate mark being disposed at positions spaced apart from an upper edge of the resin package.

2. The light emitting device according to claim 1 , wherein the outer side surface provided with the second gate mark is arranged opposite side of the first outer side surface.

3. The light emitting device according to claim 1 , wherein the first gate mark is arranged symmetrically with the second gate mark with respect to a straight line (L 1 ) passing through a center of the recessed portion and extending in a direction in parallel to the first outer side surface.

4. The light emitting device according to claim 1 , wherein at least one of the first gate mark and the second gate mark is arranged on a straight line (L 2 ) passing through the center of the recessed portion and extending in a direction perpendicular to the first outer side surface.

5. The light emitting device according to claim 1 , wherein the first gate mark and the second gate mark are arranged asymmetrically with respect to a straight line (L 1 ) passing through a center of the recessed portion and extending in a direction in parallel to the first outer side surface.

6. The light emitting device according to claim 1 , wherein the first gate mark and the second gate mark are arranged so that in the recessed portion a straight line (L a ) connecting a center of the first gate mark and a center of the second gate mark intersects the straight line (L 2 ) passing through the center of the recessed portion and extending in a direction perpendicular to the first outer side surface.

7. The light emitting device according to claim 5 , wherein the center of the first gate mark is not on the straight line (L 2 ).

8. The light emitting device according to claim 5 , wherein the center of the second gate mark is not on the straight line (L 2 ).

9. The light emitting device according to claim 1 , wherein the second outer side surface provided with the second gate mark is arranged adjacent to the first outer side surface, the second gate mark is arranged on an opposite side of the first gate mark with respect to a line (L 1 ) passing through the center of the recessed portion and extending in a direction in parallel to the first outer side surface, and the second gate mark is also arranged on an opposite side of the first gate mark with respect to a line (L 2 ) passing through the center of the recessed portion and extending in a direction perpendicular to the first outer side surface.

10. The light emitting device according to claim 3 , wherein when the light emitting device is viewed from a side of the first outer side surface, the second gate mark has a region which does not overlap with the first gate mark.

11. The light emitting device according to claim 1 , wherein the first gate mark or the second gate mark is formed by cutting a gate formed on the outer side surface at a time of injecting the resin package material in a designated mold.

12. The light emitting device according to claim 1 , wherein at least one of the first gate mark and the second gate mark is formed two or more on a same side surface.

13. The light emitting device according to claim 1 , wherein the resin package material includes a thermosetting resin containing a triazine derivative epoxy resin.

14. A method of manufacturing a light emitting device having a resin package having an outer side surface and defining a recessed portion serving as a mounting region of a light emitting element, and a lead arranged at a bottom surface of the recessed portion, the method comprising:
a step of holding a lead frame with an upper mold and a lower mold paired with the upper mold, the upper mold having a protruding portion fitting in with the recessed portion, an inlet port for injecting a resin package material, which is provided on a first wall surface corresponding to the outer side surface, and an outlet port for discharging the resin package material injected from the inlet port, the outlet port being provided on a wall surface different than the first wall surface;
a step of injecting the resin package material from the inlet port in a space defined by the upper mold and the lower mold to fill the space with the resin package material;
a step of discharging the resin package material injected in the space from the outlet port;
a step of curing the resin package material filled in the cavity to form a resin molded body;
a step of removing the molds and cutting gates formed on the resin molded body at portions corresponding to the inlet port and the outlet port to form a first gate mark and a second gate mark on different outer side surfaces with the first gate mark and the second gate mark being disposed at positions spaced apart from an upper edge of the resin molded body so as to obtain the resin package formed of the resin package material and obtain the first gate mark and the second gate mark each of which is made only of the resin package material, each of the first gate mark and the second gate mark being one of a projection projecting out from a corresponding one of the outer side surfaces or a recess depressed inwardly from the corresponding one of the outer side surfaces;
a step of mounting the light emitting element on the lead frame and electrically connecting the light emitting element and the lead frame; and
a step of disposing a sealing member in the recessed portion after the step of electrically connecting the light emitting element and the lead frame.

15. The method of manufacturing a light emitting device according to claim 14 , wherein the wall surface provided with the outlet port is arranged at a location opposite to the first wall surface with the protruding portion interposing therebetween.

16. The method of manufacturing a light emitting device according to claim 14 , wherein the inlet port is arranged symmetrically with the outlet port with respect to a straight line (L 3 ) passing through a center of the protruding portion and extending in parallel to the first wall surface.

17. The method of manufacturing a light emitting device according to claim 16 , wherein the inlet port and the outlet port are arranged on a straight line (L 4 ) passing through the center of the protruding portion and extending perpendicular to the first wall surface.

18. The method of manufacturing a light emitting device according to claim 14 , wherein the inlet port and the outlet port are arranged asymmetricall

Assignees

• Hayashi Masaki
• Nichia Corp

Inventors

• Hayashi Masaki

Classifications

• B29C45/0046

  Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity · CPC title

• B29C45/34

  having venting means · CPC title

• B29C2045/0027

  Gate or gate mark locations · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title