Light emitting device

Patent metadata

Field	Value
Publication number	US-9704940-B2
Application number	US-201615162667-A
Country	US
Kind code	B2
Filing date	May 24, 2016
Priority date	Jan 18, 2006
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

It is an object of the present invention to prevent an insulating film from peeling in a section where the insulating film is adjacent to a sealing region. Over a first substrate 104 , a pixel portion 100 provided with a light emitting element, a source driver 101 , a gate driver 102 , and a sealing region 103 are provided. A light emitting element is sealed between the first substrate 104 and a second substrate 110 by a sealant 108 . An insulating film 107 serves as a partition wall of the light emitting element. An end portion of the insulating film 107 which is adjacent to the sealing region 103 does not overlap with a step formed by a side surface and an upper surface of a conductive film 106 which serves as a wiring.

First claim

What is claimed is:

1. A light emitting device comprising:
a first substrate including a pixel portion and a sealing region;
a sealant formed in the sealing region which surrounds the pixel portion;
a second substrate fixed to the first substrate by the sealant;
a first insulating film formed over the first substrate;
a conductive film formed over the first insulating film, the conductive film comprising a first portion and a second portion; and
a second insulating film formed over and in contact with the conductive film and the first insulating film,
wherein an end portion and a side surface of the second insulating film are in contact with the sealant,
wherein a top edge of the second insulating film is covered with the sealant,
wherein the end portion of the second insulating film does not overlap with a step formed by a side surface and an upper surface of the conductive film, wherein the end portion of the second insulating film is between the first portion and the second portion of the conductive film,
wherein the pixel portion comprises a light emitting element, and
wherein the second insulating film comprises organic resin.

2. The light emitting device according to claim 1 , wherein the organic resin comprises one selected from the group consisting of acrylic, polyimide-polyamide, and polyimideamide.

3. The light emitting device according to claim 1 , wherein the conductive film comprises one selected from the group consisting of aluminum, titanium, molybdenum, and tungsten.

4. The light emitting device according to claim 1 , wherein the first insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.

5. A light emitting device comprising:
a first substrate including a pixel portion and a sealing region;
a sealant formed in the sealing region which surrounds the pixel portion;
a second substrate fixed to the first substrate by the sealant;
a first insulating film formed over the first substrate;
a conductive film formed over the first insulating film, the conductive film comprising a first portion and a second portion; and
a second insulating film formed over and in contact with the conductive film and the first insulating film,
wherein an end portion and a side surface of the second insulating film are in contact with the sealant,
wherein a top edge of the second insulating film is covered with the sealant,
wherein the end portion of the second insulating film does not overlap with a step formed by a side surface and an upper surface of the conductive film, wherein the end portion of the second insulating film is between the first portion and the second portion of the conductive film,
wherein the pixel portion comprises a light emitting element, and
wherein the second insulating film comprises inorganic material.

6. The light emitting device according to claim 5 , wherein the second insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.

7. The light emitting device according to claim 5 , wherein the conductive film comprises one selected from the group consisting of aluminum, titanium, molybdenum, and tungsten.

8. The light emitting device according to claim 5 , wherein the first insulating film comprises one selected from the group consisting of a silicon oxide, a silicon nitride, and a silicon oxynitride.

Assignees

• Semiconductor Energy Lab

Inventors

• Amano Seiko

Classifications

• H05B33/04 Primary

  Sealing arrangements {, e.g. against humidity} · CPC title

• H01L51/5253

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic

• H01L27/3262

  Electricity · mapped topic

• H01L27/1244

  Electricity · mapped topic