Systems and methods for forming microchannel plate (MCP) photodetector assemblies

Patent metadata

Field	Value
Publication number	US-9704900-B1
Application number	US-201615098194-A
Country	US
Kind code	B1
Filing date	Apr 13, 2016
Priority date	Apr 13, 2016
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A MCP photodetector assembly includes an anode plate including a plurality of electrical traces positioned thereon, a plurality of MCPs and a plurality of grid spacers. The MCPs are positioned between the grid spacers. The grid spacers have a grid spacer shape defining at least one aperture. A plurality of shims are positioned between the grid spacers and the MCPs so as to form a stack positioned on the anode plate. Each of the plurality of shims have a shim shape which is the same as the grid spacer shape such that each of the plurality of shims and each of the plurality of grid spacers overlap so as to define at least one MCP aperture. At least a portion of the plurality of MCPs are positioned within the MCP aperture. The shims are structured to electrically couple the MCPs to the anode plate.

First claim

What is claimed is:

1. A microchannel plate (MCP) photodetector assembly, comprising:
an anode plate including a plurality of electrical traces positioned thereon;
a plurality of microchannel plates (MCPs);
a plurality of grid spacers, the plurality of MCPs positioned between the plurality of grid spacers, each of the plurality of grid spacers having a grid spacer shape defining at least one aperture; and
a plurality of shims positioned between each of the plurality of grid spacers and the plurality of MCPs so as to form a stack, the stack positioned on the anode plate, each of the plurality of shims having a shim shape, the shim shape and the grid spacer shape being the same such that each of the plurality of shims and each of the plurality of grid spacers overlap so as to define at least one MCP aperture,
wherein at least a portion of the plurality of MCPs is positioned within the MCP aperture, and wherein each shim of the plurality of shims includes an electrically conductive material so as to conduct an electric signal to a corresponding surface of a corresponding MCP in contact with a respective shim, each shim further including a tab positioned proximate to the anode plate, the tab extending beneath the stack so as to contact a corresponding electrical trace of the plurality of electrical traces, thereby electrically coupling the corresponding surface of the corresponding MCP to the corresponding electrical trace.

2. The MCP photodetector assembly of claim 1 , wherein each shim further comprises a leg extending orthogonally away from a side of the shim towards the anode plate, and wherein the tab is positioned on an end of the leg located proximate to the anode plate.

3. The MCP photodetector assembly of claim 1 , further comprising:
a photocathode positioned on the stack opposite the anode plate.

4. The MCP photodetector assembly of claim 3 , further comprising:
a sidewall positioned on the anode plate, the sidewall defining a boundary within which the stack is positioned;
a top plate formed from a transparent material, the top plate positioned on the stack; and
a sealing member positioned between the sidewall and the top plate,
wherein the anode plate, the sidewall, the top plate and the sealing member define an internal volume within which the stack is positioned.

5. The MCP photodetector assembly of claim 4 , wherein the photocathode comprises a thin film of a photocathode material disposed on an inner surface of the top plate.

6. The MCP photodetector assembly of claim 4 , wherein the internal volume is vacuum sealed, the vacuum sealing configured to urge the top plate towards the anode plate so as to compress the stack, thereby securing the stack, and the electrical coupling between the tab of each of the plurality of shims and the corresponding electrical trace of the plurality of electrical traces of the anode plate.

7. The MCP photodetector assembly of claim 1 , wherein at least a portion of the electrical traces of the anode plate are electrically coupled to an electrical ground.

8. The MCP photodetector assembly of claim 1 , wherein each of the plurality of grid spacers include a grid spacer frame defining a perimeter, and wherein at least one orthogonal grid spacer cross member is positioned between opposing sidewalls of the grid spacer frame.

9. The MCP photodetector assembly of claim 8 , wherein each of the plurality of shims include a shim frame corresponding to the grid spacer frame, and wherein each shim includes at least one orthogonal shim cross-member positioned between opposing sidewalls of the shim frame, the at least one shim cross-member corresponding to the at least one grid spacer cross-member.

10. The MCP photodetector assembly of claim 1 , wherein each of the plurality of grid spacers is formed from a transparent material.

11. A microchannel plate (MCP) photodetector packaging assembly for stacking and electrically coupling a plurality of microchannel plates (MCPs), comprising;
an anode plate including a plurality of electrical traces positioned thereon;
a plurality of grid spacers, each of the plurality of MCPs positionable between a pair of the plurality of grid spacers so as to be interposed therebetween; and
a plurality of shims positionable between each of the plurality of grid spacers and the plurality of MCPs so as to form a stack, the stack positionable on the anode plate,
wherein each of the plurality of shims includes an electrically conductive material so as to conduct an electric signal to a corresponding surface of a corresponding MCP in contact with a respective shim of the plurality of shims, each shim further including a leg extending orthogonally away from a side of the shim towards the anode plate, a tab positioned on an end of the leg located proximate to the anode plate, the tab extending orthogonally from the leg so as to be positionable beneath the stack, the tab structured to contact a corresponding electrical trace of the plurality of electrical traces so as to electrically couple the corresponding surface of the corresponding MCP to the corresponding electrical trace.

12. The MCP photodetector packaging assembly of claim 11 , further comprising;
a photocathode positionable on the stack opposite the anode plate.

13. The MCP photodetector packaging assembly of claim 12 , further comprising:
a sidewall positioned on the anode plate, the sidewall defining a boundary within which the stack is positionable;
a top plate formed from a transparent material, the top plate positionable on the stack; and
a sealing member positionable between the spacer and the top plate,
wherein the anode plate, the sidewall, the top plate and the sealing member define the internal volume within which the stack is positionable.

14. The MCP photodetector packaging assembly of claim 13 , wherein the internal volume is configured to be vacuum sealed, the vacuum sealing configured to urge the top plate towards the anode plate so as to compress the stack, thereby securing the stack, and the electrical coupling between the tab of each of the plurality of shims and the corresponding electrical trace of the plurality of electrical traces of the anode plate.

15. The MCP photodetector packaging assembly of claim 13 , wherein the photocathode comprises a thin film of a photocathode material disposed on an inner surface of the top plate.

16. The MCP photodetector packaging assembly of claim 11 , wherein each of the plurality of grid spacers includes a grid spacer frame defining a perimeter, and wherein at least one orthogonal grid spacer cross member is positioned between opposing sidewalls of the grid spacer frame.

17. The MCP photodetector packaging assembly of claim 16 , wherein each of the plurality of shims includes a shim frame corresponding to the grid spacer frame, and wherein each shim includes at least one orthogonal shim cross-member positioned between opposing sidewalls of the shim frame, the at least one shim cross-member corresponding to the at least one grid spacer cross-member.

Assignees

• Uchicago Argonne Llc

Inventors

• Xia Lei
• Zhao Huyue
• Wagner Robert G
• Gregar Joseph S
• Xie Junqi
• Wang Jingbo

Classifications

• H01L27/14636

  Electricity · mapped topic

• H01L27/14618 Primary

  Electricity · mapped topic

• H01L27/14683

  Electricity · mapped topic

• H10F39/811

  Interconnections · CPC title

• H10F39/011

  Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title