Perforated conductive material for EMI shielding of semiconductor device and components

Patent metadata

Field	Value
Publication number	US-9704811-B1
Application number	US-201514978294-A
Country	US
Kind code	B1
Filing date	Dec 22, 2015
Priority date	Dec 22, 2015
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.

First claim

The invention claimed is:

1. An electrical device, comprising:
one or more electrical devices attached to a substrate;
one or more grounding pads attached to the substrate;
a perforated conductive material placed on the substrate, wherein the perforated conductive material is one of a metal foil with a plurality of holes, a porous copper foam material, and a metal mesh and wherein the perforated conductive material allows a molding compound to pass through; and
wherein the molding compound deposited over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.

2. The device of claim 1 , wherein the one or more electrical devices include a processor.

3. The device of claim 1 , wherein the one or more electrical devices include a memory device.

4. The device of claim 1 , wherein the one or more grounding pads includes conductive material that connects to electric ground.

5. The device of claim 1 , wherein the perforated conductive material is layered over the one or more devices; and
the perforated conductive material is connected to the one or more grounding pads, such that the perforated conductive material covers the one or more devices.

6. The device of claim 1 , wherein the perforated conductive material is placed on the substrate between the one or more devices, such that the perforated conductive material shields each device on the substrate from electromagnetic interference from other devices attached to the substrate.

7. The device of claim 6 , wherein the perforated conductive material is a metal ribbon.

8. A method, comprising:
attaching one or more electrical devices to a substrate;
attaching one or more grounding pads to the substrate;
placing a perforated conductive material on the substrate, wherein the perforated conductive material is one of a metal foil with a plurality of holes, a porous copper foam material, and a metal mesh and wherein the perforated conductive material allows a molding compound to pass through; and
depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.

9. The method of claim 8 , wherein attaching one or more electrical devices to the substrate includes attaching a processor.

10. The method of claim 8 , wherein attaching one or more electrical devices to the substrate includes attaching a memory device.

11. The method of claim 8 , wherein the one or more grounding pads included conductive material that connects to electric ground.

12. The method of claim 8 , wherein placing a perforated conductive material on the substrate further comprises:
layering a perforated conductive material over the one or more devices; and
connecting the perforated conductive material to the one or more grounding pads, such that the perforated conductive material covers the one or more devices.

13. The method of claim 8 , wherein placing a perforated conductive material on the substrate further comprises:
placing the perforated conductive material on the substrate between the one or more devices, such that the perforated conductive material shields each device on the substrate from electromagnetic interference from other devices attached to the substrate.

14. The method of claim 13 , wherein placing a perforated conductive material includes placing a metal ribbon.

15. The method of claim 8 , wherein placing a perforated conductive material includes placing a perforated metal foil.

16. The method of claim 8 , wherein placing a perforated conductive material includes placing a porous copper foam material.

17. The method of claim 8 , wherein placing a perforated conductive material includes placing a metal mesh.

18. The method of claim 8 , wherein the perforated conductive material is nonconductive material with a metallization coating.

19. The electric device of claim 8 , further comprising:
separating the substrate into one or more distinct systems in a package.

20. A non-transitory computer readable storage medium storing one or more programs for execution by one or more processors, the one or more programs comprising instructions for:
attaching one or more electrical devices to a substrate;
attaching one or more grounding pads to the substrate;
placing a perforated conductive material on the substrate, wherein the perforated conductive material is one of a metal foil with a plurality of holes, a porous copper foam material, and a metal mesh and wherein the perforated conductive material allows a molding compound to pass through; and
depositing the molding compound over and through the perforated conductive material to cover the perforated conductive material, the one or more devices under the perforated conductive material, and the one or more grounding pads.

Assignees

• Intel Corp

Inventors

• Dias Rajendra C
• Heppner Joshua D
• Modi Mitul B
• Prakash Anna M

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/016

  using moulds · CPC title