Electric power converter and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9704777-B2
Application number	US-201514852909-A
Country	US
Kind code	B2
Filing date	Sep 14, 2015
Priority date	Sep 12, 2014
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

An electric power converter includes a laminated semiconductor unit, a beam member that supports the laminated semiconductor unit from a rear end in a laminating direction, a frame, and a plurality of pressing plates. The frame that accommodates the laminated semiconductor unit, and has an insertion opening in a rear thereof in the laminating direction into which the laminated semiconductor unit can be inserted. The plurality of pressing plates are accommodated between a front wall portion of the frame and the laminated semiconductor unit, and the pressing plates press the laminated semiconductor unit in a direction from the front toward the rear. The plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction. The beam member is fixed to the frame.

First claim

What is claimed is:

1. An electric power converter comprising:
a laminated semiconductor unit formed by laminating semiconductor modules and cooling pipes that cool the semiconductor modules, the laminated semiconductor unit having a length in a laminating direction, and one end of the length is defined as a first end, while an opposite end is defined as a second end;
a beam member that supports the laminated semiconductor unit from the second end in a laminating direction;
a frame that accommodates the laminated semiconductor unit, and has an insertion opening in a second end side thereof in the laminating direction into which the laminated semiconductor unit can be inserted; and
a plurality of pressing plates that are accommodated between a wall portion disposed in a first end side of the frame and the laminated semiconductor unit, the pressing plates pressing the laminated semiconductor unit in a direction from the first end toward the second end; wherein,
the plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction; and
the beam member is fixed to the frame.

2. The electric power converter according to claim 1 , wherein,
each of the pressing plates is formed of a plate-like substrate portion and a plurality of elastically deformable spring portions that are fixed to the substrate portion; and
the plurality of spring portions are distributed across the substrate portion.

3. A method of manufacturing the electric power converter according to claim 1 , comprising:
a first step of inserting and placing the laminated semiconductor unit from the insertion opening into the frame, then bringing the beam member into contact with the second end of the frame;
a second step of measuring a gap dimension between a first end of the laminated semiconductor unit and the wall portion disposed in the first end side of the frame in a condition where the laminated semiconductor unit is pressed in the laminating direction from the first end toward the second end with a predetermined pressing force;
a third step of selecting an appropriate number of the pressing plates in accordance with the gap dimension that is measured in the second step, and disposing the plurality of the pressing plates inside the frame; and
a fourth step of moving the laminated semiconductor unit towards the first end in the frame so as to sandwich the plurality of pressing plates between the wall portion disposed in the first end side of the frame and the laminated semiconductor unit and so as to elastically compress them, and fixing the beam member to the frame in a condition where the beam member abuts against the second end of the frame.

4. A method of manufacturing the electric power converter according to claim 2 , comprising:
a first step of inserting and placing the laminated semiconductor unit from the insertion opening into the frame, then bringing the beam member into contact with the second end of the frame;
a second step of measuring a gap dimension between a first end of the laminated semiconductor unit and the wall portion disposed in the first end side of the frame in a condition where the laminated semiconductor unit is pressed in the laminating direction from the first end toward the second end with a predetermined pressing force;
a third step of selecting an appropriate number of the pressing plates in accordance with the gap dimension that is measured in the second step, and disposing the plurality of the pressing plates inside the frame; and
a fourth step of moving the laminated semiconductor unit towards the first end in the frame so as to sandwich the plurality of pressing plates between the wall portion disposed in the first end side of the frame and the laminated semiconductor unit and so as to elastically compress them, and fixing the beam member to the frame in a condition where the beam member abuts against the second end of the frame.

5. The method for manufacturing the electric power converter according to claim 3 , wherein,
the laminated semiconductor unit and the beam member are in a condition of being integrated at least between the first step and the fourth step.

6. The method for manufacturing the electric power converter according to claim 4 , wherein,
the laminated semiconductor unit and the beam member are in a condition of being integrated at least between the first step and the fourth step.

Assignees

• Denso Corp

Inventors

• Nakagawa Eiji

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title