Method of forming a wrap-around contact on a semiconductor device

Patent metadata

Field	Value
Publication number	US-9704744-B2
Application number	US-201315026822-A
Country	US
Kind code	B2
Filing date	Dec 19, 2013
Priority date	Dec 19, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.

First claim

What is claimed:

1. A method of forming a semiconductor device, comprising:
depositing a contact material of an initial contact layer on a source region or drain region or both of at least two semiconductor bodies and separated from each other by a trench and disposed over a substrate; and
re-sputtering the contact material of the initial contact layer to redistribute at least some of the contact material onto at least one portion of the semiconductor bodies within the trench.

2. The method of claim 1 wherein the semiconductor bodies have a top and sidewalls extending from, and transverse to, the top, and wherein depositing comprises depositing the initial contact layer at least on the top, and the re-sputtering redistributes the contact material onto the sidewalls.

3. The method of claim 1 wherein depositing comprises depositing contact material at a bottom of the trench, and wherein re-sputtering redistributes at least some of the contact material from the bottom of the trench onto the sidewalls of the semiconductor bodies.

4. The method of claim 1 comprising:
forming a sacrificial portion of the initial contact layer; and
redistributing the sacrificial portion during the re-sputtering of the contact material.

5. The method of claim 1 wherein the contact material comprises titanium.

6. The method of claim 1 wherein the semiconductor bodies have a top and sidewalls extending transverse to the top, and wherein a contact layer at the sidewalls resulting after the resputtering is at least about 1-5 nm thick.

7. The method of claim 1 wherein re-sputtering comprises directing a plasma bombardment material toward the initial contact layer and on a biased wafer.

8. The method of claim 1 comprising depositing the contact material on a surface of a spacer disposed at a gate electrode intersecting the semiconductor bodies and while depositing the contact material of the initial contact layer, and comprising depositing a sufficient amount of the contact material on the surface of the spacer to form a sacrificial layer at the spacer to avoid damage to the spacer during re-sputtering.

9. The method of claim 1 wherein the semiconductor bodies have a top and sidewalls extending from, and transverse to, the top, and wherein depositing comprises depositing the initial contact layer at least on the top, and the re-sputtering redistributes the contact material onto the sidewalls,
wherein depositing comprises depositing contact material at a bottom of the trench, and wherein re-sputtering redistributes at least some of the contact material from the bottom of the trench onto the sidewalls of the semiconductor bodies;

the method comprising:
forming a sacrificial portion of the initial contact layer; and
redistributing the sacrificial portion during the re-sputtering of the contact material,
wherein the sacrificial portion adds about 10-20 nm to the height of the initial contact layer,
wherein the contact material comprises titanium,
wherein a contact layer at the sidewalls resulting after the resputtering is at least about 1-5 nm thick,
wherein re-sputtering comprises directing a plasma bombardment material toward the initial contact layer and on a biased wafer; and
the method comprising depositing the contact material on a surface of a spacer disposed at a gate electrode intersecting the semiconductor bodies and while depositing the contact material of the initial contact layer, and comprising depositing a sufficient amount of the contact material on the surface of the spacer to form a sacrificial layer at the spacer to avoid damage to the spacer during re-sputtering.

10. The method of claim 4 wherein the sacrificial portion adds about 10-20 nm to the height of the initial contact layer.

Assignees

• Intel Corp

Inventors

• Leib Jeffrey S
• Troeger Ralph T
• Bergstrom Daniel

Classifications

• H10P14/418

  the conductive layers comprising transition metals · CPC title

• H10P14/44 Primary

  Physical vapour deposition [PVD] · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10W20/054

  by selectively removing parts thereof (H10W20/034 takes precedence) · CPC title