Method for producing ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9704649-B2
Application number	US-201113105926-A
Country	US
Kind code	B2
Filing date	May 12, 2011
Priority date	May 19, 2010
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO 2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

First claim

What is claimed is:

1. A method for producing a ceramic electronic component, comprising:
a step of preparing a component main body including a pair of end surfaces, a pair of principal surfaces, a pair of side surfaces, a ceramic layer, and an internal electrode;
a step of forming an external terminal electrode on a portion of the pair of principal surfaces, a portion of the pair of side surfaces, and an entirety of the pair of end surfaces, the step of forming the external terminal electrode including at least a step of forming a first electrode layer by applying and firing a conductive paste; and
before the step of forming the first electrode layer, a step of providing water repellency including a step of providing a water repellent agent by dehydration and condensation on at least the portion of the pair of principal surfaces, at least the portion of the pair of side surfaces, the entirety of the pair of end surfaces, and a surface of an oxide film of the internal electrode; wherein
the water repellent agent comprises a CF 3 group.

2. The method for producing a ceramic electronic component according to claim 1 , wherein the step of forming the external terminal electrode further includes a step of forming a second electrode layer;
the step of forming the second electrode layer comprises a step of forming a plating film; and
the step of forming the plating film is performed after the step of providing water repellency.

3. The method for producing a ceramic electronic component according to claim 2 , further comprising a step of removing the water repellent agent from at least one of the surfaces of the component main body on which the plating film is to be formed, after the step of providing water repellency and before the step of forming a plating film.

4. The method for producing a ceramic electronic component according to claim 1 , wherein the component main body has a laminated structure including a plurality of stacked ceramic layers and a plurality of internal electrodes formed along specific interfaces between the ceramic layers and being partially exposed, the plurality of stacked ceramic layers including the ceramic layer and the plurality of internal electrodes including the internal electrode; and
the step of forming the external terminal electrode comprises a step of forming the external terminal electrode on the pair of end surfaces of the component main body to electrically connect the external terminal electrode to the plurality of internal electrodes.

Assignees

• Saito Junichi
• Kobayashi Toshihiko
• Ogawa Makoto
• Motoki Akihiro
• Kawasaki Kenichi
• Kunishi Tatsuo
• Murata Manufacturing Co

Inventors

• Saito Junichi
• Kobayashi Toshihiko
• Ogawa Makoto
• Motoki Akihiro
• Kawasaki Kenichi
• Kunishi Tatsuo

Classifications

• B05D7/14

  to metal, e.g. car bodies (involving a chemical reaction between the metal and the coating C23) · CPC title

• B05D5/12

  to obtain a coating with specific electrical properties · CPC title

• B05D1/38

  with intermediate treatment (intermediate treatment per se B05D3/00) · CPC title

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• H01G2/103 Primary

  Sealings, e.g. for lead-in wires; Covers · CPC title