Polymer composites with electromagnetic interference mitigation properties

Patent metadata

Field	Value
Publication number	US-9704613-B2
Application number	US-201414769554-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Feb 21, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

Polymer composites that are suitable for use as electromagnetic interference mitigaters include a lossy polymeric matrix, ceramic particles dispersed within the polymeric matrix, and conductive particles dispersed within the polymeric matrix. The lossy polymeric matrix may be a fluorocarbon-based polymer matrix, or an epoxy-based polymer matrix. The ceramic particles may be metal oxide particles, especially copper oxide (CuO) particles. The conductive particles may be carbon black. Other electromagnetic interference mitigating polymer matrices include a lossy polymeric matrix and copper oxide (CuO) particles dispersed within the polymeric matrix.

First claim

What is claimed is:

1. A composite comprising:
a lossy polymeric matrix, wherein the lossy polymeric matrix has a dielectric loss tangent of from 0.005 to 0.50 and wherein the lossy polymeric matrix comprises a fluorocarbon-based polymeric matrix comprising a polyvinylidene fluoride polymer or copolymer;
ceramic particles dispersed within the polymeric matrix; and
conductive particles dispersed within the polymeric matrix, wherein the composite is
an electromagnetic interference mitigating material.

2. The composite of claim 1 , wherein the fluorocarbon-based polymer or copolymer comprises a terpolymer of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride.

3. The composite of claim 1 , wherein the ceramic particles are selected from the group consisting of metal oxide particles, metal nitride particles, metal carbide particles, metal sulfide particles, metal silicide particles, metal boride particles, particles of multiferroic compounds, mixed ceramic particles, chalcogenide glass particles, or a combination thereof.

4. The composite of claim 3 , wherein the metal oxide particles comprise copper oxide (CuO) particles.

5. The composite of claim 1 , wherein the conductive particles are selected from the group consisting of carbon black, carbon bubbles, carbon foams, graphene, carbon fibers, graphite, carbon nanotubes, metal particles and nanoparticles, metal alloy particles, metal nanowires, PAN fibers, conductive-coated particles, or a combination thereof.

6. The composite of claim 1 , wherein the lossy polymeric matrix comprises a terpolymer of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride, and wherein the ceramic particles comprise copper oxide (CuO) particles, and wherein the conductive particles comprise carbon black.

7. The composite of claim 1 , wherein the lossy polymeric matrix comprises a polyvinylidene fluoride polymer, and wherein the ceramic particles comprise copper oxide (CuO) particles, and wherein the conductive particles comprise carbon black.

8. The composite of claim 1 , wherein the composite mitigates electromagnetic interference in the 100 MegaHertz-100 GigaHertz range.

9. The composite of claim 1 , wherein the composite mitigates electromagnetic interference in the 1-20 GigaHertz range.

10. A composite comprising:
a lossy polymeric matrix, wherein the lossy polymeric matrix has a dielectric loss tangent of from 0.005 to 0.50 and wherein the lossy polymeric matrix comprises comprises a terpolymer of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride; and
copper oxide (CuO) particles dispersed within the polymeric matrix, wherein the
composite is an electromagnetic interference mitigating material.

11. The composite of claim 10 , wherein the composite mitigates electromagnetic interference in the 100 MegaHertz-100 GigaHertz range.

Assignees

• 3M Innovative Properties Co

Inventors

• Ghosh Dipankar
• Roy Biplab K
• Satarkar Nitin S

Classifications

• C08K2003/2248

  of copper · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C08K3/22

  of metals · CPC title

• H01B1/24

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• C08K3/046

  Carbon nanorods, nanowires, nanoplatelets or nanofibres · CPC title