Extrusion molding apparatus
US-2016027542-A1 · Jan 28, 2016 · US
US9704609B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9704609-B2 |
| Application number | US-201113984334-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2011 |
| Priority date | Feb 15, 2011 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
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Provided is an ion exchange resin volume reduction apparatus in which the ignition of plasma is facilitated and the plasma is prevented from extinguishing. A volume reduction apparatus according to aspects of the present invention includes a stage carrying thereon a resin to be treated, a CCP power source, and an ICP power source. The volume reduction apparatus according to a certain aspect of the present invention is provided with a supply mechanism, and the CCP power source continues operating when the resin to be treated is supplied in a depressurized state to a vacuum vessel. In the volume reduction apparatus according to a certain aspect of the present invention, the CCP power source continues operating when a gas condition under which gas is supplied into the vacuum vessel is changed.
Opening claim text (preview).
The invention claimed is: 1. A volume reduction apparatus, comprising: a heatable stage that is disposed inside a vacuum vessel and formed to place thereon a resin to be treated which carries a radioactive substance; a CCP power source that supplies a voltage or an electric field by capacitive coupling to a space above the stage inside the vacuum vessel; an ICP power source that supplies power by inductive coupling to oxygen plasma induced in the space; a coil connected at least to the ICP power source; a supply mechanism configured to supply the resin to be treated to the stage while maintaining a depressurized state of the vacuum vessel; and a computer or a sequential control unit configured to control the CCP power source and the ICP power source, wherein the CCP power source and the ICP power source are provided separately from each other, and the computer or the sequential control unit is configured such that when a voltage or an electric field that ignites the oxygen plasma is to be supplied to the space, the voltage or electric field is simultaneously supplied from the CCP power source and the ICP power source, and thereafter, the voltage or electric field is supplied from the CCP power source also when the resin to be treated is additionally supplied to the stage by the supply mechanism, to prevent plasma extinction. 2. The volume reduction apparatus according to claim 1 , wherein the resin to be treated includes moisture, and the resin to be treated that has been supplied to the stage by the supply mechanism releases water vapor. 3. The volume reduction apparatus according to claim 1 , wherein the coil is disposed at a position directly or indirectly facing, with an insulating wall of the vacuum vessel interposed, the space above the stage inside the vacuum vessel and is also connected to the CCP power source. 4. The volume reduction apparatus according to claim 3 , wherein the coil is also electrically connected to an output of the CCP power source; the ICP power source outputs power for ICP frequency, and a CCP frequency blocking circuit that blocks an output from the CCP power source is connected to the ICP power source; and the CCP power source outputs power for CCP frequency, and an ICP frequency blocking circuit that blocks an output from the ICP power source is connected to the CCP power source. 5. The volume reduction apparatus according to claim 1 , wherein the coil is disposed at a position directly or indirectly facing, with an insulating wall of the vacuum vessel interposed, the space above the stage inside the vacuum vessel and is connected to the ICP power source; the volume reduction apparatus further comprising: a CCP electrode that is disposed at a position of either a central section surrounded by the ICP coil or a peripheral section surrounding the ICP coil and that is connected to the CCP power source. 6. The volume reduction apparatus according to claim 1 , wherein the computer or a sequential control unit configured such that the voltage or electric field is supplied from only the CCP power source when the resin to be treated is additionally supplied to the stage by the supply mechanism. 7. A volume reduction apparatus, comprising: a heatable stage that is disposed inside a vacuum vessel and formed to place thereon a resin to be treated which carries a radioactive substance; a CCP power source that supplies a voltage or an electric field by capacitive coupling to a space above the stage inside the vacuum vessel; an ICP power source that supplies power by inductive coupling to oxygen plasma induced in the space; a coil electrically connected at least to the ICP power source; a gas condition control unit that changes a supply condition for gas supplied to the space inside the vacuum vessel from a first gas condition to a second gas condition different from the first gas condition; and a computer or a sequential control unit configured to control the CCP power source and the ICP power source, wherein the CCP power source and the ICP power source are provided separately from each other, and the computer or the sequential control unit is configured such that when a voltage or an electric field that ignites the oxygen plasma is to be supplied to the space, the voltage or electric field is simultaneously supplied from the CCP power source and the ICP power source, and thereafter the voltage or electric field is supplied from the CCP power source also when the supply condition is changed by the gas condition control unit, to prevent plasma extinction. 8. The volume reduction apparatus according to claim 7 , wherein the coil is disposed at a position directly or indirectly facing, with an insulating wall of the vacuum vessel interposed, the space above the stage inside the vacuum vessel and is also connected to the CCP power source. 9. The volume reduction apparatus according to claim 8 , wherein the coil is also electrically connected to an output of the CCP power source; the ICP power source outputs power for ICP frequency, and a CCP frequency blocking circuit that blocks an output from the CCP power source is connected to the ICP power source; and the CCP power source outputs power for CCP frequency, and an ICP frequency blocking circuit that blocks an output from the ICP power source is connected to the CCP power source. 10. The volume reduction apparatus according to claim 7 , wherein the coil is disposed at a position directly or indirectly facing, with an insulating wall of the vacuum vessel interposed, the space above the stage inside the vacuum vessel and is connected to the ICP power source; the volume reduction apparatus further comprising: a CCP electrode that is disposed at a position of either a central section surrounded by the ICP coil or a peripheral section surrounding the ICP coil and that is connected to the CCP power source.
by melting the waste (G21F9/305, G21F9/32 take precedence) · CPC title
using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/26 takes precedence) · CPC title
Antennas, e.g. particular shapes of coils · CPC title
Electricity · mapped topic
Processing (separating different isotopes of the same chemical element B01D59/00) · CPC title
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