Fastenerless hinge which enables thin form factor low cost design

US9703327B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9703327-B2
Application numberUS-201514752938-A
CountryUS
Kind codeB2
Filing dateJun 27, 2015
Priority dateJun 27, 2015
Publication dateJul 11, 2017
Grant dateJul 11, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.

First claim

Opening claim text (preview).

The invention claimed is: 1. A notebook device, comprising: a chassis supporting electronic circuitry therein; and a hinge assembly coupled to the chassis, the hinge assembly comprising: a hinge bracket; wherein the hinge bracket has an elevated portion and a base portion thereby providing a hollow portion between the elevated portion and the base portion; the hinge bracket further comprises at least one spring tab extending from the base portion towards the elevated portion into the hollow portion; and a hinge wing slidably coupled to the hinge bracket through the hollow portion for frictional engagement with the at least one spring tab; wherein an insertion force for inserting the hinge wing into the hollow of the hinge bracket is different than an extraction force for removing the hinge wing from the hollow of the hinge bracket due to the orientation of the at least one spring tab. 2. The notebook device of claim 1 , wherein the notebook device is a 2-in-1 device. 3. The notebook device of claim 1 , wherein the hinge bracket is within the chassis. 4. The notebook device of claim 1 , wherein a portion of the hinge bracket is translucent. 5. The notebook device of claim 1 , wherein the height of the hinge assembly is between 1.8 mm and 2.8 mm. 6. The notebook device of claim 1 , wherein the at least one spring tab has a spring force in the range of 0.75 lbs and 1.0 lbs. 7. The notebook device of claim 1 , wherein the dimensions of the hinge wing is approximately 10 mm by 15 mm. 8. The notebook device of claim 1 , wherein the extraction force required to remove the hinge wing from the hinge bracket is greater than the insertion force required to insert the hinge wing into the hinge bracket. 9. The notebook device of claim 8 , wherein the insertion force is between 1.0 lbs and 1.5 lbs and the extraction force is between 1.5 lbs and 2.0 lbs.

Assignees

Inventors

Classifications

  • to allow easy separation {or connection} of the parts at the hinge axis ({E05D5/12 and E05D15/50 take precedence } ; substitutes for hinges E05D1/06) · CPC title

  • G06F1/1681Primary

    Details related solely to hinges (hinge details related to the transmission of signals or power are classified in G06F1/1683) · CPC title

  • with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

  • Pivotal connections (hinges for doors, windows or wings E05D) · CPC title

  • E05D7/1061Primary

    in a radial direction (E05D7/1005 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9703327B2 cover?
The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously,…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification G06F1/1681. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).