Inorganic fiber molded body and process for producing the same
US-9751281-B2 · Sep 5, 2017 · US
Refractory walls, and gasification devices and methods
US9702628B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9702628-B2 |
| Application number | US-201113037968-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2011 |
| Priority date | Mar 29, 2010 |
| Publication date | Jul 11, 2017 |
| Grant date | Jul 11, 2017 |
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Abstract
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A refractory wall comprises a hotface layer comprising a hotface surface configured to be adjacent to a carbonaceous gasification environment, a backing layer facing the hotface layer, and a cooling layer facing the backing layer and configured to cool the hotface layer via the backing layer. A gasification device and a gasification process are also presented.
First claim
Opening claim text (preview).
What is claimed is: 1. A refractory wall comprising: a refractory hotface layer comprising a hotface surface configured to be adjacent to a carbonaceous gasification environment; a backing layer facing and disposed around the refractory hotface layer to improve the mechanical strength of the refractory hotface layer, wherein the refractory hotface layer and the backing layer comprise chromium-containing materials; a cooling layer facing the backing layer and positioned between…
Assignees
Inventors
Classifications
- F27D1/0006Primary
Mechanical Engineering · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9702628B2 cover?
- A refractory wall comprises a hotface layer comprising a hotface surface configured to be adjacent to a carbonaceous gasification environment, a backing layer facing the hotface layer, and a cooling layer facing the backing layer and configured to cool the hotface layer via the backing layer. A gasification device and a gasification process are also presented.
- Who is the assignee on this patent?
- Chen Wei, Dong Honghai, Yang Zhaohui, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification F27D1/0006. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Jul 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).