Conductive adhesive, anisotropic conductive film, and electronic device using same

Patent metadata

Field	Value
Publication number	US-9701874-B2
Application number	US-201414781746-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Apr 2, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

[Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

First claim

The invention claimed is:

1. A conductive adhesive comprising conductive fillers and a binder resin, the binder resin comprising an epoxy (meth)acrylate resin, and the epoxy (meth)acrylate resin being formed by adding a (meth)acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, wherein the epoxy compound comprises at least one allyl ether selected from the group consisting of bisphenol-F diallyl ether, 2,6,2′,6′-tetramethyl bisphenol-A diallyl ether, 2,2′-diallyl bisphenol-A diallyl ether, 2,2′-di-t-butyl bisphenol-A diallyl ether, 3,3′,5,5′-tetramethyl biphenyl-4,4′-diallyl ether, 2,2′-diisopropyl bisphenol diallyl ether, 4,4′-ethylidene bisphenol diallyl ether, 4,4′-cyclohexylidene bisphenol diallyl ether, 4,4′-(1-α-methylbenzylidene) bisphenol diallyl ether, 4,4′-(3,3,5-trimethyl cyclohexylidene) bisphenol diallyl ether, 4,4′-(1-methyl-benzylidene) bisphenol diallyl ether, 2,2′-biphenyl diallyl ether, tetramethyl biphenyl diallyl ether, 1,5-pentanediol diallyl ether, 1,6-hexanediol diallyl ether, 1,9-nonanediol diallyl ether, 1,10-decanediol diallyl ether, neopentyl glycol diallyl ether, glycerin triallyl ether, trimethylolpropane triallyl ether, pentaerythritol tetraallyl ether, 1,4-cyclohexanedimethanol diallyl ether, tricyclo[5.2.1.0 2,6 ] decanedimethanol diallyl ether.

2. The conductive adhesive according to claim 1 , wherein a raw material for the epoxy (meth)acrylate resin is an epoxy compound obtained by epoxidizing a carbon-carbon double bond of a raw material compound having a carbon-carbon double bond, using a peroxide as an oxidant.

3. The conductive adhesive according to claim 1 , wherein the content of the binder resin in the conductive adhesive is 5 to 90% by mass.

4. The conductive adhesive according to claim 1 , wherein the conductive filler is a particle or a fiber made of at least one kind of metal, or an alloy of a plurality of kinds of metal, the metal being selected from the group consisting of gold, silver, copper, nickel, aluminum, and palladium; a metal particle or fiber the surface of which is plated with gold, palladium, or silver; a resin core ball having a resin ball plated with nickel, gold, palladium, or silver; a carbon or graphite particle or fiber; or the metal particle, the core ball, the carbon or graphite particle the surface of which is coated with an insulation resin thin film.

5. The conductive adhesive according to claim 1 , wherein the allyl ether is bisphenol-F diallyl ether or 1,4-cyclohexanedimethanol diallyl ether.

6. The conductive adhesive according to claim 1 , wherein the allyl ether is 1,4-cyclohexanedimethanol diallyl ether.

7. The conductive adhesive according to claim 1 , wherein the sum of total chlorine atom concentration and total bromine atom concentration is from 0.7 mass ppm to 300 mass ppm.

8. The conductive adhesive according to claim 1 , wherein the sum of total chlorine atom concentration and total bromine atom concentration is 50 mass ppm or less.

9. The conductive adhesive according to claim 8 , wherein the allyl ether is 1,4-cyclohexanedimethanol diallyl ether.

10. The conductive adhesive according to claim 8 , wherein the sum of total chlorine atom concentration and total bromine atom concentration of 10 mass ppm or less.

11. An electronic device comprising a substrate on which a semiconductor element, a solar panel, a thermoelectric element, a chip part, a discrete part, or a combination thereof are mounted using the conductive adhesive according to claim 1 .

12. An electronic device in which a wiring pattern of a film antenna, a keyboard membrane, a touch panel, a RFID antenna is formed and connected to a substrate, using the conductive adhesive according to claim 1 .

13. An anisotropic conductive film comprising the conductive adhesive according to claim 1 , wherein 0.1 to 20% by mass of conductive particles are dispersed in the binder resin.

14. The anisotropic conductive film according to claim 13 , wherein the epoxy compound has the sum of a total chlorine atom concentration and a total bromine atom concentration of 50 mass ppm or less.

15. The anisotropic conductive film according to claim 13 , wherein the epoxy (meth)acrylate resin is formed from an epoxy resin obtained by using a raw material compound having a carbon-carbon double bond, and by epoxidizing the carbon-carbon double bond using a peroxide as an oxidant.

16. The anisotropic conductive film according to claim 13 , wherein the conductive particle used is at least one kind of metal, or an alloy of a plurality of kinds of metal, the metal being selected from the group consisting of gold, silver, copper, nickel, aluminum, and palladium; a metal particle the surface of which is plated with gold, palladium, or silver; a resin core ball having a resin ball plated with nickel, gold, palladium, or silver; a carbon or graphite particle; or the particle as mentioned above the surface of which is coated with an insulation resin thin film.

17. An electronic device in which electronic components are connected by anisotropic conductive connection, using the anisotropic conductive film according to claim 13 .

Assignees

• Showa Denko Kk

Inventors

• Uchida Hiroshi
• Ishibashi Yoshitaka

Classifications

• C08K7/18

  inorganic · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C08K2003/0862

  Nickel · CPC title

• C09J7/00

  Adhesives in the form of films or foils · CPC title