Resin composition, prepreg using the same, and fiber-reinforced composite material

US9701815B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9701815-B2
Application numberUS-201113812422-A
CountryUS
Kind codeB2
Filing dateJul 26, 2011
Priority dateJul 26, 2010
Publication dateJul 11, 2017
Grant dateJul 11, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A resin composition that has good heat resistance and handleability and that can produce a prepreg which has a good balance between tackyness and drapability and which causes little resin flow during prepreg molding, a prepreg that is manufactured using the resin composition, and a fiber-reinforced composite are provided. A resin composition that contains a maleimide compound, diallyl bisphenol A, and a diallyl isophthalate polymer, a prepreg in which reinforcing fibers are impregnated with the resin composition, and a fiber-reinforced composite material that is obtained by molding the prepreg are provided.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising an aromatic maleimide compound, an aliphatic maleimide compound, diallyl bisphenol A and a diallyl isophthalate polymer, wherein the resin composition is a blend in which the following formulas are satisfied when amounts of the aromatic maleimide compound, the aliphatic maleimide compound, the diallyl bisphenol A and the diallyl isophthalate polymer are represented by [a1], [a2], [b] and [c], respectively, in parts by mass: [ a 1]+[ a 2]=100  (1) [ b ]≧20  (2) [ b ]≦−1.4×[ a 2]+140  (3) [ b ]≧−3.6×[ a 2]+90  (4) 15≦[ c ]≦65  (5) 0≦[ a 2]≦45  (6). 2. A resin composition comprising an aromatic maleimide compound, an aliphatic maleimide compound, diallyl bisphenol A and a diallyl isophthalate polymer, wherein the resin composition is a blend in which the following formulas are satisfied when the amounts of the aromatic maleimide compound, the aliphatic maleimide compound, the diallyl bisphenol A and the diallyl isophthalate polymer are represented by [a1], [a2], [b] and [c], respectively, in parts by mass: [ a 1]+[ a 2]=100  (7) 40≦[ b ]≦80  (8) 15≦[ a 2]≦40  (9) 20≦[ c ]≦60  (10). 3. The resin composition according to claim 1 or 2 , wherein a weight average molecular weight of the diallyl isophthalate polymer is 30000 or more and 50000 or less in terms of standard polystyrene equivalent. 4. A prepreg obtained by impregnating reinforcing fibers with a resin composition according to claim 1 or 2 . 5. The prepreg according to claim 4 , wherein the reinforcing fibers are carbon fibers. 6. A fiber-reinforced composite material obtained by molding a prepreg according to claim 4 . 7. The resin composition according to claim 1 , wherein the aromatic maleimide compound is a mixture of aromatic maleimide compounds represented by the following formula I: wherein “n” in formula I is 0.3 to 0.4 on average. 8. The resin composition according to claim 1 , wherein the aliphatic maleimide compound is a polyfunctional maleimide compound that has two or more maleimide compounds in which a main chain that links the maleimide compounds is mainly composed of hydrocarbon. 9. The resin composition according to claim 1 , wherein the aromatic maleimide compound is selected from the group consisting of N,N′-m-phenylenedimaleimide, N,N′-p-phenylenedimaleimide, 4,4′-bismaleimidodiphenylether, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-bismaleimidodiphenylmethane, 4-methyl-1,3-phenylenedimaleimide, 2,2-bis-[4-(4-maleimidophenoxy)phenyl]propane, N,N′-2,4-tolylenedimaleimide and N,N′-2,6-tolylenedimaleimide. 10. The resin composition according to claim 1 , wherein the aliphatic maleimide compound is 1,6-dimaleimido-(2,2,4-trimethyl)hexane. 11. The resin composition according to claim 1 or 2 , wherein the composition further comprises a peroxide. 12. The resin composition according to claim 2 , wherein the aromatic maleimide compound is selected from the group consisting of N,N′-m-phenylenedimaleimide, N,N′-p-phenylenedimaleimide, 4,4′-bismaleimidodiphenylether, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-bismaleimidodiphenylmethane, 4-methyl-1,3-phenylenedimaleimide, 2,2-bis-[4-(4-maleimidophenoxy)phenyl]propane, N,N′-2,4-tolylenedimaleimide and N,N′-2,6-tolylenedimaleimide. 13. The resin composition according to claim 2 , wherein the aliphatic maleimide compound is 1,6-dimaleimido-(2,2,4-trimethyl)hexane.

Assignees

Inventors

Classifications

  • Unsaturated polyesters · CPC title

  • on to polymers of esters · CPC title

  • C08K5/3415Primary

    Five-membered rings · CPC title

  • Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers (C08L45/00 takes precedence; of conjugated diene rubbers C08L9/00 - C08L21/00) · CPC title

  • Imides, e.g. cyclic imides · CPC title

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What does patent US9701815B2 cover?
A resin composition that has good heat resistance and handleability and that can produce a prepreg which has a good balance between tackyness and drapability and which causes little resin flow during prepreg molding, a prepreg that is manufactured using the resin composition, and a fiber-reinforced composite are provided. A resin composition that contains a maleimide compound, diallyl bisphenol…
Who is the assignee on this patent?
Harada Yukihiro, Kaneko Manabu, Sano Tomoo, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08K5/3415. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).