Thermal head and thermal printer

Patent metadata

Field	Value
Publication number	US-9701131-B2
Application number	US-201415108053-A
Country	US
Kind code	B2
Filing date	Nov 27, 2014
Priority date	Dec 25, 2013
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.

First claim

The invention claimed is:

1. A thermal head, comprising:
a substrate;
a plurality of heat generating portions disposed on the substrate;
a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and
a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins,
the housing being disposed adjacent to the substrate in a sub-scanning direction,
the housing including a support portion disposed under the substrate, and
the substrate and the support portion being apart from each other.

2. A thermal head, comprising:
a substrate;
a plurality of heat generating portions disposed on the substrate;
a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively;
a wiring board which is disposed adjacent to the substrate and includes a plurality of wirings electrically connected to the plurality of electrodes, respectively; and
a connector including a plurality of connector pins which pinch the wiring board and are electrically connected to the plurality of wirings, respectively, and a housing for containing the plurality of connector pins,
the housing being disposed adjacent to the wiring board in a sub-scanning direction,
the housing including a support portion disposed under the wiring board, and
the wiring board and the support portion being apart from each other.

3. The thermal head according to claim 2 , further comprising a covering member which covers at least part of the respective connector pins, wherein
the covering member is disposed between the wiring board and the support portion.

4. The thermal head according to claim 2 , wherein
the connector pins each include a first connector pin electrically connected to the wiring, a second connector pin having a contact portion connected to the wiring board, and a third connector pin linking the first connector pin and the second connector pin to each other;
the first connector pin and the second connector pin pinch the wiring board; and
the second connector pin protrudes from the wiring board beyond the first connector pin, and the contact portion is disposed on a third connector pin side relative to a tip of the first connector pin.

5. The thermal head according to claim 2 , wherein the housing further includes a protruding portion disposed between adjacent connector pins of the plurality of connecter pins in a plan view.

6. The thermal head according to claim 5 , wherein the protruding portion is provided with a cutout portion.

7. The thermal head according to claim 2 , further comprising a heat radiating plate which is disposed under the substrate and radiates heat of the substrate, wherein
the housing is disposed adjacent to a side surface of the heat radiating plate, and
the side surface and the support portion are connected together with resin.

8. The thermal head according to claim 2 , further comprising a covering member disposed on the plurality of connector pins, wherein
the covering member includes a first portion disposed on the housing and a second portion protruding from the first portion in a direction of traveling away from the heat generating portion in a plan view.

9. The thermal head according to claim 8 , wherein each end portion of the housing in a main scanning direction is provided with the second portion.

10. A thermal printer, comprising:
a thermal head according to claim 2 ;
a conveying mechanism which conveys a recording medium onto the plurality of heat generating portions; and
a platen roller which presses a recording medium against the plurality of heat generating portions.

11. The thermal head according to claim 1 , further comprising a covering member which covers at least part of the respective connector pins, wherein
the covering member is disposed between the substrate and the support portion.

12. The thermal head according to claim 1 , wherein the housing further includes a protruding portion disposed between adjacent connector pins of the plurality of connecter pins in a plan view.

13. The thermal head according to claim 12 , wherein the protruding portion is provided with a cutout portion.

14. The thermal head according to claim 1 , further comprising a heat radiating plate which is disposed under the substrate and radiates heat of the substrate, wherein
the housing is disposed adjacent to a side surface of the heat radiating plate, and
the side surface and the support portion are connected together with resin.

15. The thermal head according to claim 1 , wherein
the connector pins each include a first connector pin electrically connected to the electrode, a second connector pin having a contact portion connected to the substrate, and a third connector pin linking the first connector pin and the second connector pin to each other;
the first connector pin and the second connector pin pinch the substrate; and
the second connector pin protrudes from the substrate beyond the first connector pin, and the contact portion is disposed on a third connector pin side relative to a tip of the first connector pin.

16. The thermal head according to claim 1 , further comprising a covering member disposed on the plurality of connector pins, wherein
the covering member includes a first portion disposed on the housing and a second portion protruding from the first portion in a direction of traveling away from the heat generating portion in a plan view.

17. The thermal head according to claim 16 , wherein each end portion of the housing in a main scanning direction is provided with the second portion.

18. A thermal printer, comprising:
a thermal head according to claim 1 ;
a conveying mechanism which conveys a recording medium onto the plurality of heat generating portions; and
a platen roller which presses a recording medium against the plurality of heat generating portions.

Assignees

• Kyocera Corp

Inventors

• Ookubo Yuuna
• Yamamoto Yasumitsu
• Hirayama Masafumi
• Hirose Shouji
• Hatanaka Takumi
• Takada Hisatoshi
• Moto Youichi
• Tanaka Yui
• Iwamoto Yousuke

Classifications

• B41J2/345

  characterised by the arrangement of resistors or conductors · CPC title

• B41J2/3352

  Integrated circuits · CPC title

• B41J2/3357

  Surface type resistors · CPC title

• B41J2/3354

  characterised by geometry · CPC title

• B41J2/3351 Primary

  Electrode layers · CPC title